5G high-frequency compatible products, with APP memory and technologies for thinning and reducing the diameter of the core layer, using CO2 laser drilling techniques for TH holes.
TH (Through Hole) Processing Results ■No.1: Example of processing untreated substrate Cu direct board thickness 200μm Hole diameter φ70μm ■No.2: Example of processing untreated substrate Cu direct thin board Board thickness 40μm to 100μm Hole diameter φ40μm to φ70μm
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【Contract Processing Request】【Specification Inquiry】 ■For contract processing requests and specification details, please contact us through the inquiry section on this page.
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[Usage/Examples of Achievements] ■For inquiries regarding contract processing requests or specification details, please contact us using the inquiry section on this page.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.
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