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Non-contact transport device - List of Manufacturers, Suppliers, Companies and Products

Non-contact transport device Product List

31～33 item / All 33 items

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Non-contact transport device for green sheets "Float Chuck SAG type"

Non-contact transport device for green sheets "Float Chuck SAG type"

Transporting green sheets by air.

The non-contact transport device for ceramic green sheets, "Float Chuck SAG Type," holds and transports ceramic green sheets in a non-contact manner by blowing air through gas. The "Float Chuck SAG Type" is equipped with a nozzle that prevents high-speed air flow from directly colliding with the green sheet, thereby protecting the thin and fragile green sheets, which are 120μm thick, from damage and breakage due to the high-speed air flow. Additionally, the "Float Chuck SAG Type" uses a small amount of air, making it efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets of 120μm thickness. 4. Can transport ceramic green sheets without bending them. 5. Low air consumption. 6. Does not pollute the environment.

  • Other conveying machines
  • Circuit board processing machine
  • Pneumatic Equipment

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Non-contact transport device for sapphire substrate wafers "Float Chuck WAS" type

Non-contact transport device for sapphire substrate wafers "Float Chuck WAS" type

A Bernoulli chuck equipped with an exhaust recovery mechanism that reduces exhaust to the clean room, suitable for use in a clean room with a positioning mechanism.

1. Exhaust Recovery Mechanism: The cleanroom-compatible Bernoulli chuck "Float Chuck WAS type" is composed of an operating surface facing the wafer being held, a cushion chamber provided at the center of the operating surface, a nozzle located at the center of the cushion chamber, and a hood around the outer periphery of the operating surface. The high-speed air flow ejected from the nozzle flows into the gap between the operating surface and the wafer without contacting the walls of the cushion chamber or the wafer. The amount of negative pressure generated by the ejector effect in the cushion chamber also increases, allowing for efficient negative pressure generation. The exhaust air that passes through the gap between the operating surface and the wafer is captured by the surrounding hood and is drawn out through the exhaust port to a designated location. As a result, the high-speed air jet rarely flows into the cleanroom, preventing the discharge of debris and the lifting of dust. 2. Positioning Mechanism: The guide attached to the "Float Chuck WAS type" has a shape at the bottom end that contacts the outer peripheral touchable part of the held wafer, which regulates the free movement of the wafer. Therefore, positioning is possible even though the wafer is held non-contact.

  • Other semiconductor manufacturing equipment

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Non-contact transport device of the Solar Research Institute: Float Chuck SAC type

Non-contact transport device of the Solar Research Institute: Float Chuck SAC type

Custom-made vertical gas jet non-contact transport device "Float Chuck SAC Type"

We will manufacture a custom-made "Bernoulli chuck - non-contact transport device" that adopts a new mechanism of the Bernoulli chuck "Float Chuck SAC type," which has the Bernoulli effect, ejector effect, and Coanda effect. The new mechanism: The non-contact transport device "Float Chuck SAC type" has been enhanced with the Coanda effect to increase the ejector effect that generates suction power. It is a high-efficiency, low gas consumption non-contact transport device that combines the Bernoulli effect. This new method employs the "vertical jet airflow method" with the Bernoulli chuck for the non-contact transport device.

  • Other semiconductors
  • CVD Equipment
  • LCD display

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