UV laser processing [copper foil removal processing]
■ Trepanning processing with a diameter of 25um or more is possible using a very small diameter beam. ■ Punching processing with a minimum diameter of 10um is possible only for thin copper foil.
3. Copper foil removal processing ■No.3-1: Example of punching processing with a diameter of φ10um to φ30um (t1.5um copper foil) ■No.3-2: Example of trepanning processing with a diameter of φ25um to φ100um (t5um copper foil)
- Company:大船企業日本
- Price:Other