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BGA Reballing (High Volume Support)
We have started a service to reball a large number of BGAs in a short delivery time. Of course, we can accommodate even from 1 piece. Please feel free to contact us. (The photo shows a fixture for 1 piece.)
If it's about BGA reballing, leave it to us! We will introduce the work process.
Our company performs "BGA Rework and Reballing" using 7 IPC-recommended IR rework devices. "BGA Reballing" refers to the process of regenerating the solder balls of a BGA. The process involves removing the BGA from the circuit board, removing the solder from the BGA, applying flux or solder paste, placing the solder balls, and then heating them with an IR heater to join the solder balls. You can trust us with your BGA reballing needs. We have a track record of reballing over 50,000 BGAs with ball diameters ranging from φ0.2 to 0.76mm. We assist in rescuing discarded circuit boards. Additionally, we also accommodate changes in solder composition (from eutectic solder balls to lead-free solder balls). 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder from the BGA ■ Solder Ball Placement: Apply flux or solder paste, then place the solder balls ■ Heating: Heat with an IR heater to join the solder balls *For more details, please refer to the PDF document or feel free to contact us.
From one piece to mass production, we respond with short lead times! Feel free to leave special modifications (jumpers) to us!
At AIM, we handle various rework related to BGA, including the installation and removal of BGA/CSP, as well as the reballing of removed BGAs. We undertake 500 items of BGA rework and 200 items of reballing annually. Over 20 years of handling various products and circuit boards has allowed our technical department to accumulate a vast amount of know-how. We can respond to both rework and reballing requests from one piece to mass production with a short lead time. 【Features】 ■ Abundant track record and experience ■ Removal of BGA underfill ■ Standard rework masks and various solder balls in stock ■ ISO 9001 certified and obtained in 1998 ■ Installation of interposers and rework of PoP devices are also possible *For more details, please refer to the PDF document or feel free to contact us.
We have developed a BGA reballing method with no initial costs!
At Yamada Workshop, we perform BGA reballing. We also accept requests such as, "We can't replace it because there are no new materials available. Is it possible to reimplement the currently installed BGA?" In response, we have developed a reballing method that has no initial costs and can accommodate short lead times. We will provide a quote using the most suitable method based on the total number of BGAs you need reballing for. 【Our Reballing Services】 ■ BGA reballing for 1 to medium lot ・No initial costs ■ Reballing for medium to large lots ・Creating masks with low labor costs *For more details, please refer to the external link page or feel free to contact us.
