BGA reballing
If it's about BGA reballing, leave it to us! We will introduce the work process.
Our company performs "BGA Rework and Reballing" using 7 IPC-recommended IR rework devices. "BGA Reballing" refers to the process of regenerating the solder balls of a BGA. The process involves removing the BGA from the circuit board, removing the solder from the BGA, applying flux or solder paste, placing the solder balls, and then heating them with an IR heater to join the solder balls. You can trust us with your BGA reballing needs. We have a track record of reballing over 50,000 BGAs with ball diameters ranging from φ0.2 to 0.76mm. We assist in rescuing discarded circuit boards. Additionally, we also accommodate changes in solder composition (from eutectic solder balls to lead-free solder balls). 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder from the BGA ■ Solder Ball Placement: Apply flux or solder paste, then place the solder balls ■ Heating: Heat with an IR heater to join the solder balls *For more details, please refer to the PDF document or feel free to contact us.
- 企業：ビオラ
- 価格：Less than 10,000 yen
