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Sputtering device for three-dimensional objects

Achieve high coverage in three-dimensional object film formation! Equipped with up to three sputter cathodes, it enables the layered deposition of metal films, oxide films, and more!

The "Sputtering Device for Three-Dimensional Objects" is equipped with our proprietary sputter cathode. It features a 4-axis mechanism (elevation, revolution, rotation, tilt) on the work stage, achieving high coverage in the deposition of three-dimensional objects. It also includes a heating mechanism and bias power supply, enabling reverse sputtering, high-temperature sputtering, and film stress control. It can accommodate up to three sputter cathodes, allowing for the layered deposition of metal films, oxide films, and more. 【Features】 - Equipped with our proprietary sputter cathode - 4-axis mechanism on the work stage achieves high coverage in the deposition of three-dimensional objects - Can accommodate up to three sputter cathodes for layered deposition of metal films, oxide films, etc. - Custom orders can also be manufactured - Sample processing is conducted using a demonstration machine *For more details, please refer to the PDF document or feel free to contact us.

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Backside Metallization Solution "ECLIPSE"

DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!

"ECLIPSE" is a sputtering device using a side sputtering method for front and backside metallization, as well as for the deposition of dielectrics and piezoelectric materials. It also features a uniquely developed transport mechanism that accommodates ultra-thin wafers and fragile substrates. This device is recommended for engineers facing challenges with continuous deposition and wafer transport in sputtering processes such as backside metallization and under bump metal. 【Features】 ■ Non-contact wafer transport mechanism ■ Compatible with production 150mm wafers (wafer thickness: 250μm) ■ Also compatible with production 100mm wafers (wafer thickness: 130μm) ■ Wafer self-centering capability *For more details, please feel free to contact us.

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