Vacuum Bonding Device (Bonding Equipment) VAP250
We provide bonding equipment that enables ultra-precision lap processing and polishing processing!!
To address the demands for microfabrication and the diversified ultra-high precision requirements sought in today's processing technology, and to enable further precision pursuit while utilizing the current lap and polish processing line, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process.
- Company:テクノライズ株式会社
- Price:Other