This is a case of TGV being imaged using transmission and oblique CT with a nano-focus X-ray CT system.
This is a case where TGV (Through Glass Via: Glass Penetrating Electrode) was imaged using transmission imaging and angled CT scanning. The voids inside the Cu filled vias can be clearly observed.
The device used for imaging, 'XVA-160αII "Z"', is an ultra-high-resolution nano-focus 3D X-ray CT system. It is an ultra-high-end model that achieves nano-order analysis and can perform CT scanning in just 3.5 minutes thanks to world-class angled CT technology, contributing to improved efficiency in analysis.
【Features】
- A high-end model specialized for higher magnification, capable of analyzing the internal structure of packages.
- Equipped with a nano-focus X-ray generator (focus size 200nm and above).
- Precisely observes detailed structures at a high magnification of 2,000 times.
- Equipped with a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus.