Wafer bonding device prevents uneven wax thickness!
A bonding device for compound semiconductor wafers, etc. It is a dedicated device for wafer waxing that achieves high-quality grinding and polishing.
By optimizing the heating and cooling mechanisms and employing a high-rigidity machine design, we achieve a uniform temperature distribution and stable load distribution, preventing the occurrence of wax thickness variations that can negatively impact precision. 【Features】 ■ Pressure, temperature, and time conditions can be set according to the characteristics of the wafer ■ Damage to the device is minimized ■ Achieves uniform temperature distribution and stable load distribution ■ Prevents the occurrence of wax thickness variations that affect precision ■ Compatible with 12-inch wafers *For more details, please refer to the PDF document or feel free to contact us.
- Company：くまさんメディクス MPSD事業部 大津第1工場
- Price：Other
