BGA void analysis software "BGA Pro"
Calculate the image signal changes of BGA that are not visible in regular X-ray transmission images!
"BGA Pro" is software that identifies characteristic points of void areas in BGA balls from X-ray images and clearly displays the less visible void areas. By quantifying the void state of the BGA, it is possible to evaluate the soldering condition. Additionally, measuring the void state can be utilized as information for setting conditions such as reflow. 【Features】 ■ Calculates changes in image signals of BGA that are not visible in normal X-ray transmission images ■ Quantifies the state of solder balls based on the size of the voids and their position from the center ■ Assists in soldering evaluation *For more details, please refer to the related links or feel free to contact us.
- Company:穂高電子
- Price:Other