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  1. B7 Tokyo//software
  2. ウェーブフロント 本社 Kanagawa//software
  3. ミューテック Tokyo//software
  4. 4 日本イーエスアイ Tokyo//software
  5. 5 null/null
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  1. "Kubota Air Handling Unit" General Catalog クボタ空調
  2. Lighting and optical analysis software "Lighting Simulator CAD" Camerium
  3. Multivariate analysis software "SIMCA" インフォコム サイエンスグループ
  4. ECG/Blood Pressure Waveform メディカルトライシステム
  5. 5 SampleManager LIMS software サーモフィッシャーサイエンティフィック株式会社／Thermo Fisher Scientific K.K.

softの製品一覧

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Injection Molding Analysis Software "MAPS-3D"

Injection Molding Analysis Software "MAPS-3D"

- Complete solid, high-speed, injection molding simulation -

Consistent and Easy Complete Solid Analysis: Directly analyze 3D solid models. Usable easily by beginners regardless of specialized knowledge or experience in analysis. Large-scale Analysis Model Support: Capable of handling large-scale models thanks to proprietary high-speed analysis technology. The 64-bit solver version has no restrictions on model size. High-Speed Analysis: Equipped with powerful high-speed automatic meshing. Achieves high-precision high-speed analysis through proprietary cutting-edge algorithms. Further accelerated with support for 64-bit Windows OS and parallel CPU processing. High-Precision Analysis Technology: Adopts cutting-edge high-precision injection molding theory to deliver high-quality analysis results. Achieves high-precision analysis with high-quality layer solid meshes. Diverse High-Functionality Modules: Filling, holding pressure, warping, fiber orientation, cooling, solid runners, gate optimization, hot runner balance optimization, inserts, stress, project data management, rubber, RIM…etc.

  • Stress Analysis

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Blank Expansion Simulation 3D Quick Form

Blank Expansion Simulation 3D Quick Form

Blank Shape Prediction Professional Solution

It is an add-in software for SolidWorks. It can also be used in combination with the press die design software "3DQuickPress." This tool allows die designers to easily consider and create blank shapes. The blank development creates an initial blank based on analysis results. It can determine the development shape of complex drawing shapes. Additionally, the simulation automatically generates the mesh. Adjustments to fit different situations are also possible. For more details, please contact us or download the catalog.

  • Other CAD
  • Other analyses
  • 3D CAD

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3D Press Mold Strip Layout Design 3DQuickStrip

3D Press Mold Strip Layout Design 3DQuickStrip

3D strip layout design software 3DQuickStrip

**Overview** 3DQuickStripLayout unfolds the model and designs layouts, bends, and cuts at the station. The production of progressive dies is under significant pressure due to quality, delivery times, and increasingly complex shapes. The traditional 2D approach cannot speed up processes or minimize errors. This software provides the latest technology and facilitates smooth communication with customers, preventing mistakes and optimizing production. It is an add-on for SolidWorks. e-Drawing can be effectively utilized for communication. In addition to being a component of 3DQuickPress, it can also be used as a module. This can be utilized for process front-loading involving the sales department.

  • Image analysis software

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Press Die Simulation "3DSimSTAMP"

Press Die Simulation "3DSimSTAMP"

Comprehensive verification of mold structure! Virtual trial of molds - 3D mold structure simulation.

"3DSimSTAMP" is a simulation software used to verify die structure data designed with 3DQuickPress before the actual trial. It is used to predict press forming defects in advance, to clarify the mechanisms of those defects, and to consider methods for correction. 3DSimSTAMP enables virtual trials on a PC and can be utilized as a tool to shorten lead times. For more details, please contact us or download the catalog.

  • Other CAD related software
  • 3D CAD
  • simulator

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Electromagnetic field analysis software "JMAG"

Electromagnetic field analysis software "JMAG"

Electromagnetic field analysis software JMAG

A general-purpose electromagnetic field analysis software with a complete material database and the top market share in the industry. Customized pre- and post-processing specifically for electromagnetic field analysis enables easy data creation and processing of analysis results.

  • Other analyses

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Aerospace Design Analysis and Aerodynamic Analysis Software 'AMI'

Aerospace Design Analysis and Aerodynamic Analysis Software 'AMI'

Aerodynamic analysis software series for aircraft design

AMI, specializing in aerodynamic analysis, provides excellent aerodynamic/hydraulic design analysis software that is used worldwide for aerodynamic/hydraulic design in aerospace, defense, marine, automotive, and turbine industries.

  • Thermo-fluid analysis

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[Musculoskeletal Analysis Case] Example of Closed Chain Problem (Analysis of Ladder Climbing)

[Musculoskeletal Analysis Case] Example of Closed Chain Problem (Analysis of Ladder Climbing)

Smoothly adjustable distribution degree! An analysis case of a subject's movements skillfully using both hands and feet to climb a ladder.

In AnyBody, the "soft constraint" option resolves motion analysis, and the concept of "virtual muscles" through the extension of the muscle distribution algorithm addresses the dynamics problems of redundant systems. In this article, we introduce a case study of analyzing "ladder climbing," where a closed state is continuously maintained. This analysis focuses on the subject's movements as they skillfully use both hands and feet to climb the ladder. In AnyBody, the ON-OFF switching of the "virtual muscles" that connect the person and the ladder occurs at the timing when both hands and feet engage with or detach from the ladder. Furthermore, for example, the distribution can be smoothly adjusted based on the degree of contact (horizontal axis). [Contents] ■ What is a closed chain? ■ Solutions to closed chain problems *Detailed information about the case study can be viewed through the related links. For more information, please feel free to contact us.

  • Mechanism Analysis

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[Case Study of Thermal Fluid Analysis] Forced Air Cooling Analysis of a Notebook PC

[Case Study of Thermal Fluid Analysis] Forced Air Cooling Analysis of a Notebook PC

Forced air cooling analysis conducted with a fan modeled using P-Q characteristics! Introducing a case study of a notebook PC analysis.

This article presents a case study of a laptop analysis using AcuSolve. Heat generation values are set for each component, such as the CPU and memory. A pin-type heat sink is placed on the CPU, and forced air cooling analysis is performed using a fan modeled with P-Q characteristics. 【Contents】 ■ Model Description (Laptop Analysis) ■ Analysis Results *Detailed information about the case study can be viewed via the related links. For more details, please feel free to contact us.

  • Software (middle, driver, security, etc.)

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Electromagnetic Field Analysis Software 'INTEGRATED'

Electromagnetic Field Analysis Software 'INTEGRATED'

Creation of shape data, physical conditions/mesh creation, examination of results! We have extensive analysis experience.

The "INTEGRATED Electromagnetic Field Analysis Software" combines usability and accuracy, contributing to prototype reduction in a wide range of design scenarios. It can read data created in CAD or create model shapes using the built-in modeler. The user-friendly GUI allows for easy setting of physical conditions, and with a high-precision mesh generator built-in, users can focus on their designs. Powerful post-processing, graph creation tools, and parametric calculation tools enable users to output the desired results without stress. 【Features】 ■ Reads data created in CAD or creates model shapes using the built-in modeler ■ Allows for easy setting of physical conditions with a user-friendly GUI ■ Built-in high-precision mesh generator ■ Users can focus on their designs ■ Users can output desired results without stress *For more details, please refer to the related links or feel free to contact us.

  • Magnetic field analysis/electromagnetic wave analysis

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[Case Study of the Molding Process] Analysis of Hole Expansion Processing Using JSTAMP

[Case Study of the Molding Process] Analysis of Hole Expansion Processing Using JSTAMP

Check the FLD (Forming Limit Diagram)! It is predicted that cracks are likely to occur near the edges of the holes indicated in red!

We would like to introduce a case study where a blank with a hole was processed using cylindrical drawing, and an analysis was conducted to widen the hole. The die stroke speed was set to 6000 mm/s, the load on Holder 1 was 1200 N, and the load on Holder 2 was 600 N, with the FLD (Forming Limit Diagram) being checked. As a result, it was found that the deformation state of the blank was close to uniaxial tension according to the FLD. Additionally, it is anticipated that cracks are likely to occur near the edge of the hole indicated in red. 【Model Overview】 ■ Die stroke speed: 6000 mm/s ■ Load on Holder 1: 1200 N ■ Load on Holder 2: 600 N *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis

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[Heat-Fluid-Structure Coupling Example] Cooling of a Metal Pipe

[Heat-Fluid-Structure Coupling Example] Cooling of a Metal Pipe

Cooling water absorbs heat from the metal pipe while flowing! The solver uses the high-precision version R10.1.0 of MPPDYNA.

We will introduce a case where cold water is flowed through a high-temperature metal pipe for cooling, analyzed as a thermal-fluid-structure coupled problem. The solver used is the R10.1.0 high-precision version of MPPDYNA, with parallel computation on 16 CPUs. As a result, the metal pipe is cooled and the temperature decreases, while the cooling water absorbs heat from the metal pipe as it flows, resulting in higher temperatures downstream. Additionally, the temperature at the surface in contact with the solid becomes higher than that on the inside, and in the final state, the temperature of the metal pipe approaches the temperature of the fluid (283.15[K]). 【Key Keywords】 ■*ICFD_BOUNDARY_FSI: Specify the fluid-structure coupling boundary ■*ICFD_CONTROL_FSI: Set default values for fluid-structure coupled analysis ■*ICFD_BOUNDARY_CONJ_HEAT: Perform heat exchange with the solid at the fluid-structure coupling boundary ■Other: Input *CONTROL_SOLUTION, soln=2 to set up thermal-structure coupled analysis *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis

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[Fluid-Structure Interaction Case] Drop Analysis of a Water-Filled Bottle Using the ALE Method

[Fluid-Structure Interaction Case] Drop Analysis of a Water-Filled Bottle Using the ALE Method

Check the effects of settings that allow fluid mesh movement to follow the structure!

This presentation introduces a case study of fluid-structure interaction analysis using the ALE method in "LS-DYNA," focusing on the drop analysis of a water-filled bottle. In addition to the conventional ALE method, analyses were conducted using the Structured-ALE (S-ALE) available from Ver.R9 and the automatic conversion function from the ALE model to the S-ALE model available from Ver.R10. Results comparing behavior and computation time are presented. When comparing Case 1 and Case 2, as well as Case 3 and Case 4, it is confirmed that the S-ALE exhibits behavior nearly identical to that of the conventional ALE while also reducing computation time. 【Model Overview】 - A water-filled bottle is placed at a 5-degree tilt on a horizontal rigid floor. - Initial velocity of 4,000 mm/s and gravitational acceleration are applied to the entire model for the drop analysis. *For more details, please refer to the related links or feel free to contact us.*

  • Structural Analysis

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[Magnetic Field - Heat - Structural Coupling Case] Analysis of Ultra-High Magnetic Field Generation

[Magnetic Field - Heat - Structural Coupling Case] Analysis of Ultra-High Magnetic Field Generation

Reproducing the "constricted" compression shape of a coil! Here is an example applied to a high magnetic field generation method.

Here is an example of ultra-high magnetic field generation analysis. By utilizing the magnetic field analysis function available from LS-DYNA Ver.R7, it is possible to conduct a magnetic field-thermal-structural coupled analysis considering large deformations of the coil using only "LS-DYNA." In the comparison of analysis results and experimental results for high magnetic field generation and coil shapes, the analysis captures the trends of the experimental results well, and the compression shape of the coil, which appears to "converge," is reproduced. 【Roles of Each Component in Electromagnetic Concentration Method】 ■ Liner Coil: Generates ultra-high magnetic fields ■ Primary Coil: Generates a magnetic field to compress the liner coil ■ Support Coil: Provides inertial mass and stiffness to the primary coil ■ Helmholtz Coil: Generates a seed magnetic field (external field) inside the liner coil, which is "concentrated" and becomes part of the ultra-high magnetic field *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis

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[Magnetic Field - Thermal - Structural Coupling Case] Volume 1: Analysis of High Magnetic Field Generation by Coil Method

[Magnetic Field - Thermal - Structural Coupling Case] Volume 1: Analysis of High Magnetic Field Generation by Coil Method

Calculated up to 3 μsec! The analysis results and experimental results for the magnetic field generated at the center of the coil match well!

By utilizing the magnetic field analysis function available from LS-DYNA Ver.R7, it is possible to conduct a magnetic field-thermal-structural coupled analysis considering large deformations of coils using only "LS-DYNA." The coil in this case study is made of copper, and calculations were performed up to 3 microseconds. In the analysis, the electrical conductivity of copper is approximated using the Burgess model, which takes into account the electrical conductivity of copper in both solid and liquid states as implemented in this product. 【Case Overview】 ■ Magnetic field generated at the center of the coil - The analysis results align well with the experimental results. - It is evident that LS-DYNA's magnetic field-thermal-structural coupled analysis is highly accurate. ■ Deformation process of the coil and temperature distribution - There are areas that significantly exceed the melting point of copper (1358K), but in the analysis, these are considered in a liquid state, and the electrical conductivity in that state is taken into account. *For more details, please refer to the related links or feel free to contact us.

  • Structural Analysis

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