Cleaning unit for semiconductor wafers 'PA10-Q60AE-S'
Efficient removal of fine particles through direct substrate irradiation. Precision wafer cleaning unit using high-frequency megasonic. *Demo unit available.
The proximity megasonic cleaning unit "PA10-Q60AE-S" directly irradiates high-frequency sound waves of 1.0MHz or 3.0MHz onto the substrate, efficiently removing fine particles and residues in a non-contact manner. Equipped with a unique liquid supply system, it ensures a uniform cleaning area up to the outer edge of the substrate. It minimizes liquid splatter and energy loss, making it suitable for the precise cleaning of semiconductor wafers and photomask substrates with fine structures. The main body is made of high-purity quartz, which has low dust generation and excellent chemical resistance, allowing for combined cleaning with strong acids and strong alkalis. Its direct irradiation method above the substrate is compatible with single-wafer cleaning devices, enabling flexible design for each process. [Applications] - Removal of fine particles from semiconductor wafers - Cleaning of residues after photoresist stripping - Cleaning after TSV, MEMS structures, and film formation, etc. *Demo units are available for you to check the usability. *For more details, please download the PDF or feel free to contact us.
- Company：プレテック 静岡製作所
- Price：Other
