[Case Study] Inspection of Large PCBs for Medical Devices
Please utilize Takaya's flying probe tester for the inspection of large substrates for medical devices (in conjunction with boundary scan).
By combining visual inspection, non-contact scanning, and physical probing, we meet the stringent reliability standards in the medical device field, achieving both quality improvement and cost reduction. 【Implementation Achievements】 - Achieved full inspection in inline testing, ensuring product quality. - Enhanced defect detection capabilities for large substrates and complex design boards through collaboration with boundary scan technology. 【Challenges Faced by Customers】 Limitations of APT alone: Flying probe testers excel in electrical characteristic testing, but physical access for probing is difficult for components with hidden pin connections, such as BGA and QFP. In high-density substrates, there are areas that cannot be fully covered by probing alone. Constraints of AOI: Cannot detect defects (such as solder bridges or connection failures) located beneath BGA or large components. Internal connections and micro shorts in multilayer substrates cannot be detected. In large substrates, areas beyond the field of view occur, making it difficult to efficiently inspect the entire area. Challenges with large substrates and complex designs: In large substrates, inspection time tends to increase for both AOI and APT, leading to decreased productivity. Full inspection of high-density mounted substrates requires an efficient inspection system that combines physical probing and non-contact inspection.
- Company:TAKAYA Corporation
- Price:Other