Flying Probe Tester Product List and Ranking from 4 Manufacturers, Suppliers and Companies

For large-scale substrate in-circuit testing, please consider Takaya!

Supports DIB and PIB inspections!

Are you having trouble with ICT (In-Circuit Testing) for oversized PCBs? Even for oversized PCBs known as DIB (Device Interface Board) or PIB (Probe Interface Board), you can rely on Takaya's flying probe testers. By using our unique optional mechanisms, we can perform ICT inspection on PCBs up to 985x610mm in size without any modifications. Additionally, we are happy to accommodate automatic transport for heavy PCBs and individual customizations within the inspection area. For more details about Takaya's flying probe testers, please feel free to download the PDF catalog or contact your sales representative.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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Accelerating the inspection of flying probe testers using deep reinforcement learning.

We have published a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating the inspection of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), we displayed and introduced a report on this research. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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Integration features with MES systems compatible with the international standard OPC UA.

Exhibiting at Nepcon 2024 from January 24! Achieving interoperability between industrial equipment and MES systems!

OPC UA (OPC Unified Architecture) is an open international standard developed for safe and reliable data exchange in industries such as industrial automation. It was announced by the OPC Foundation in 2008 and later standardized as IEC62541. It allows for secure and highly reliable data exchange across different types of devices, operating systems, and manufacturers, making it recommended as the standard communication for Industrie 4.0 and increasingly adopted worldwide. Additionally, it is aligned with the international standard for PLCs, IEC61131-3, which provides the advantage of reliably exchanging information from the manufacturing site with higher-level monitoring control systems and Manufacturing Execution Systems (MES). In response to this trend, Takaya has prepared an option to equip the APT series of flying probe testers with an OPC UA server. We are working to promote the spread of industrial IoT standards that bridge FA equipment and IT.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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Flying Probe Tester APT-2400F-SL

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F-SL is a large model that maintains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long boards up to W985×D610mm. It can accommodate component heights of up to 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

Company：TAKAYA Corporation
Price：Other

Other measurement, recording and measuring instruments

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Dual Side Flying Probe Tester APT-2600FD-SL

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. On July 31, 2025, at the Keidanren Kaikan in Otemachi, Chiyoda-ku, Tokyo, this product received the "Nikkankogyo Shimbun 110th Anniversary Award" at the "55th Mechanical Industry Design Award IDEA" ceremony. The judging committee praised the design philosophy that balances inspection efficiency and reliability, providing an opportunity for our technological and product design capabilities to be widely recognized. *For more details, please feel free to contact us.*

Company：TAKAYA Corporation
Price：Other

Other measurement, recording and measuring instruments

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Flying Probe Tester

Seica's high-performance flying probe tester.

PCB inspection, horizontal/vertical system, capable of double-sided probing. EV battery test system adopted by battery manufacturers.

Company：TESPRO CO.,LTD.
Price：Other

Circuit Board Inspection Equipment

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38th Electronics Packaging Society Spring Conference Presentation Materials Released

The presentation materials for the 38th Electronics Packaging Society Spring Conference are now available.

The 38th Electronics Packaging Society Spring Conference was held from March 13 (Wednesday) to 15 (Friday), 2024, at the Noda Campus of Tokyo University of Science. At this conference, Mr. Yanagida, the Technical Department Manager of Takaya Corporation's Industrial Equipment Division, gave a presentation on "The Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." The presentation materials from that session have been made available, so please take a look at the related catalog pages below. -------- Content -------- To ensure reliable assembly guarantees for printed circuit boards, electrical testing is essential. However, a single testing method alone does not provide sufficient test coverage. To address this issue, we introduce a hybrid testing system that integrates flying probe testers with JTAG boundary scan testing. By complementing each testing method, we can maximize the test coverage for high-density printed circuit boards, enabling more accurate fault diagnosis.

Company：TAKAYA Corporation
Price：Other

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[Case Study] The Importance of Electrical Testing in EMS Companies

Takahashi's flying probe tester solves the challenges faced by EMS companies.

【Implementation Results for EMS Companies】 - By conducting electrical inspections from the prototype stage of the circuit board, we achieve quality assurance before mass production. - Early optimization of circuit board design and component selection contributes to the reduction of defects in later processes. 【Challenges Faced by Customers】 Cost of Recreating Jigs: With jig-based testers, it is necessary to recreate dedicated jigs every time there is a prototype or design change. Each design change requires modifications to the jigs, significantly increasing costs and time. Insufficient Response to Design Changes: Conventional inspection methods make it difficult to respond flexibly to design changes. There were instances where long lead times made rapid verification during the prototype stage challenging.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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[Case Study] Inspection of Large PCBs for Medical Devices

Please utilize Takaya's flying probe tester for the inspection of large substrates for medical devices (in conjunction with boundary scan).

By combining visual inspection, non-contact scanning, and physical probing, we meet the stringent reliability standards in the medical device field, achieving both quality improvement and cost reduction. 【Implementation Achievements】 - Achieved full inspection in inline testing, ensuring product quality. - Enhanced defect detection capabilities for large substrates and complex design boards through collaboration with boundary scan technology. 【Challenges Faced by Customers】 Limitations of APT alone: Flying probe testers excel in electrical characteristic testing, but physical access for probing is difficult for components with hidden pin connections, such as BGA and QFP. In high-density substrates, there are areas that cannot be fully covered by probing alone. Constraints of AOI: Cannot detect defects (such as solder bridges or connection failures) located beneath BGA or large components. Internal connections and micro shorts in multilayer substrates cannot be detected. In large substrates, areas beyond the field of view occur, making it difficult to efficiently inspect the entire area. Challenges with large substrates and complex designs: In large substrates, inspection time tends to increase for both AOI and APT, leading to decreased productivity. Full inspection of high-density mounted substrates requires an efficient inspection system that combines physical probing and non-contact inspection.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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[Case Study] PCB Inspection for Lighting (LED Lighting)

Please utilize Takaya's flying probe tester for substrate inspection for lighting (LED lighting).

By utilizing color sensors for automated inspection, we overcome the limitations of visual inspection and achieve quality stabilization and efficiency. Automation reduces the burden on operators and establishes consistent inspection standards, balancing improved product reliability with cost reduction. 【Implementation Achievements】 - Transition from visual inspection to automated inspection. - Achieved quality stabilization through precise automated inspection using color sensors. 【Challenges Faced by Customers】 Operator Burden: Visual inspection relies on the skills and experience of operators, leading to issues such as fatigue and decreased concentration during long hours of work. As the burden on operators increases, the risk of decreased inspection accuracy rises. Variability in Judgment Criteria: Visual inspection involves subjective judgments by individuals, resulting in variability in quality standards. Inconsistent judgments can lead to the outflow of defective products and excessive inspection. Difficulty in Confirming LED Characteristics: Determining fine characteristics such as the color and brightness of LEDs is challenging through visual inspection. Inspections based on accurate numerical standards are required.

Company：TAKAYA Corporation
Price：Other

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We have been featured on the official website of i-PRO Co., Ltd.

Visualizing the internal state of the equipment. Streamlining maintenance support with high-definition network cameras.

We are pleased to announce that Takaya Corporation's case study has been featured on the official website of i-PRO Co., Ltd. At our company, we have been addressing the challenge of developing a flying probe tester that allows for remote monitoring of the internal conditions of the device, thereby facilitating a swift initial response in the event of a problem. To solve this issue, we have equipped our latest models, the APT-2400F and APT-2600FD, with i-PRO Co., Ltd.'s network cameras as standard. By incorporating the cameras, we can monitor the internal state of the device in real-time, which has led to faster troubleshooting and enhanced quality control in the inspection process. In this case study, we provide detailed insights from the perspective of the development team regarding: - The background leading to the standard inclusion of cameras - The reasons for product selection - Operational innovations - The effects of the integration Please check the related link below for more information.

Company：TAKAYA Corporation
Price：Other

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[Case Study] High-Density Substrate Inspection in Semiconductor Manufacturing Equipment

Please utilize Takaya's flying probe tester in the high-density substrate inspection process for semiconductor manufacturing equipment.

High-precision inspections compliant with IEC60384-1 are possible. The characteristics of electronic components such as fixed capacitors are guaranteed according to international standards, achieving improved quality for high-density boards. We flexibly respond to design changes and prototypes, providing cost-effective inspection solutions. 【Implementation Achievements】 - Conducted inspections of high-density mounted boards, achieving quality assurance tailored to precision boards. - Enabled inspections compliant with the IEC60384-1 standard (performance standards for fixed capacitors), ensuring product quality in line with international standards. 【Customer Challenges】 Narrow Pitch Between Components: In high-density boards, the space between components is extremely narrow, making physical contact difficult with traditional jig-based inspections. There is a potential decrease in inspection accuracy, especially in narrow pitch areas below 0.2mm and with high pin count components. Need for Compliance with Standards: As compliance with international standards represented by IEC60384-1 is required, a system that reliably implements inspection items based on these standards is necessary. It is particularly important to measure the characteristics of fixed capacitors and special components accurately and quickly. Limits of Inspection Coverage: In designs where the number of test points has decreased, there is a risk of reduced inspection coverage due to insufficient physical access.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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[Case Study] Inspection of Large Circuit Boards for Communication Infrastructure and Servers

Please utilize Takaya's flying probe tester for the inspection of large circuit boards for communication infrastructure and servers.

In large-scale board inspections for communication infrastructure and servers, jig-less inspection is particularly effective. Even with large board sizes, it can be handled efficiently, and this inspection method combines flexibility and precision, contributing to quality improvement and cost reduction. This significantly contributes to ensuring reliability in the fields of communication infrastructure and servers. 【Implementation Results】 - Established inspection technology tailored to the quality requirements specific to large boards. - Guaranteed the reliability of high-precision boards used in communication infrastructure devices and server products. 【Challenges Faced by Customers】 Handling of large boards: With jig-based testers, designing and manufacturing jigs for large boards is difficult. Due to weight and handling constraints, setup times are prolonged. Response to design changes: Large boards have many test points, and the cost of modifying jigs increases during design changes. The flexibility of the inspection process is low, making it unsuitable for low-volume, high-variety production. Cost and storage space: Jigs for large boards have high manufacturing costs and take up storage space. When operating multiple product lines, managing jigs becomes complicated.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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[Case Study] Board Inspection for Power Generation and Power Systems

Please utilize Takaya's flying probe tester for substrate inspection in power generation and power systems.

By combining electrical testing using APT with AOI, which is difficult for discrete components and hand-inserted parts, we achieve the high quality standards required for power generation and power system boards, providing an efficient inspection system. 【Implementation Results】 - Conducted implementation verification focused on discrete components, achieving quality assurance for power system boards that require high reliability. - Realized 100% inspection on boards including power lines and hand-inserted components. 【Challenges Faced by Customers】 Limitations of AOI Inspection: While AOI (Automated Optical Inspection) excels at inspecting surface-mounted components, it has limitations in the following areas: - Difficulty in inspecting hand-inserted components: It cannot sufficiently verify the quality of the implementation of power lines and large discrete components. - Insufficient confirmation of component position and polarity: AOI cannot accurately confirm electrical characteristics, leading to the risk of missing incorrect insertions or polarity issues. Risks During Power Supply: Defective components or miswiring in power lines can lead to damage to the board or destruction of components. Particularly, if the quality assurance for discrete components is inadequate, the risk of overheating or short circuits increases. Generation of Waste Boards: If the board is damaged during power-on testing, the disposal of defective boards occurs, leading to increased costs.

Company：TAKAYA Corporation
Price：Other

Circuit Board Inspection Equipment

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[Case Study] Circuit Board Inspection for Consumer Products

Please utilize Takaya's flying probe tester for circuit board inspection for consumer products.

In the mass production process of circuit boards for consumer products, conducting constant inspections of chip components and verifying the mounter program before assembly helps prevent lot outs and defective products from being released, achieving both efficiency in the manufacturing process and improved quality. 【Implementation Results】 - In the process of switching models for mass-produced high-density assembly boards, program verification of the mounter and constant inspections of chip components were conducted. - Efficient manufacturing processes were realized through short-duration and high-precision inspections. 【Challenges Faced by Customers】 Component Set Mistakes: There is a risk of component set mistakes during the assembly process or the installation of non-specified components. Particularly in mass production, if mistakes are discovered late, it can lead to a large number of lot outs. Program Mistakes: Due to errors in the mounter's program settings, there is a possibility that incorrect components are installed on the circuit board. If a setting mistake is discovered in a later process, the costs for rework or disposal increase. Limitations of Visual Inspection: Manual and visual checks depend on the skill and fatigue of the operator, making it easy for inspection omissions and false detections to occur.

Company：TAKAYA Corporation
Price：Other

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