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Laser Micromachining Machine Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Laser Micromachining Machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. AOCジャパン Tokyo//Industrial Machinery
  2. 東成エレクトロビーム 本社工場 Tokyo//Manufacturing and processing contract
  3. Kanagawa//Trading company/Wholesale
  4. 4 ビーム Tokyo//Testing, Analysis and Measurement
  5. 5 光機械製作所 HIKARI LASER LAB. Mie//Manufacturing and processing contract

Laser Micromachining Machine Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. CVD diamond laser microprocessing machine AOCジャパン
  2. ITO film peeling processing case: "Contract processing of laser microfabrication" 東成エレクトロビーム 本社工場
  3. Case study of drilling into tungsten material: "Contract processing of laser micro-machining" 東成エレクトロビーム 本社工場
  4. Case study of simulated stent processing for pipes: "Contract processing of laser microfabrication" 東成エレクトロビーム 本社工場
  5. 4 [Prototype Acceptance in Progress] Examples of Laser Microfabrication Applications

Laser Micromachining Machine Product List

16~25 item / All 25 items

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Case study of simulated stent processing for pipes: "Contract processing of laser microfabrication"

We accept orders for precision holes and micro-cutting processing, from prototype production to mass production.

Material: Cobalt alloy Pipe diameter: φ (phi) 1.55mm / Wall thickness: 100μm / Remaining width: approximately 100μm At Higashinaru Electro Beam Co., Ltd., we utilize laser technology for microfabrication, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can work with a variety of materials, including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.

  • Processing Contract

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Case study of drilling into molybdenum material: "Contract processing of laser microfabrication"

We accept orders for micro holes and micro cutting processing, from prototype production to mass production.

Material: Molybdenum Plate thickness: 100μm / Hole diameter: φ (phi) 200μm At Higashinaru Electro Beam Co., Ltd., we utilize laser technology for microfabrication, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can work with various materials including stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.

  • Processing Contract

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Case study of drilling into titanium materials: "Contract processing of laser micro-machining"

We accept orders for micro holes and micro cutting processing, from prototype production to mass production.

Material: Titanium Plate thickness: 100μm / Hole diameter: φ (phi) 300μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for microfabrication, offering services such as fine hole drilling, cutting, and groove processing. You can choose from laser wavelengths (IR, SHG, THG). We can work with various materials including different types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.

  • Processing Contract

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Raychar Systems laser microfabrication equipment

Raychar Systems laser micro-machining equipment

Raychar Systems Co., Ltd. Laser Microfabrication Equipment 【Features】 ○ Scribing ○ Trimming ○ Marking (Inner Mark, Glass Mark, Precision Marking) ○ Repair ○ Fine Cutting ○ Annealing ○ Patterning ○ Drilling ● For other functions and details, please contact us.

  • Contract manufacturing
  • Processing Contract

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Free presentation of laser microprocessing case studies using 3D-Micromac equipment!

Presenting examples of processing! Widely applicable in the production of solar cells, automotive parts, medical devices, and more!

3D-Micromac, a world-class manufacturer of laser microfabrication equipment based in Germany. Microfabrication devices using picosecond and femtosecond lasers are widely applied in the production of thin-film solar cells, organic EL for lighting, automotive parts, precision machine components, cutting and drilling of transparent materials with internal marking, and medical instruments. We have introduced the "picosecond laser microfabrication equipment" from 3D-Micromac, and we will respond to your prototype requests with this cutting-edge laser microfabrication equipment. Please feel free to consult with us. 【Application Examples】 ■ Thin-film solar cells ■ Organic EL for lighting ■ Automotive parts ■ Precision machine components ■ Cutting and drilling of transparent materials with internal marking ■ Medical instruments, etc. *You can view processing examples for free from the "Download" section below.

  • Company:
  • Price:Other
  • Prototype Services
  • Processing Contract
  • others

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Must-see! Laser processing done inside the resin.

Diffraction grating periodically arranged by ultrashort pulse laser.

【Material】 Polycarbonate Thickness: 1mm 【Dimensions】 Processed within a 10mm square range 【Features】 The resin contains a periodically arranged heterogeneous phase with a refractive index different from that of the material, forming a diffraction grating. When white light is transmitted, it can be observed to separate into rainbow colors as shown in the image. Applications include decorative logos, drawings, markings, lot management, and anti-counterfeiting measures. The processability varies depending on the type of resin, so please contact us if you have any materials of interest.

  • Other electronic parts

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AOC3000 Picosecond/Femtosecond Laser Micromachining Machine

Multifunction Pico-Second and Femto-Second Laser Micromachining Machine

We can propose precision processing equipment tailored to your needs, such as coaxial observation, ultra-precision stages, and dedicated optical systems for drilling, on a multifunctional platform.

  • Wafer processing/polishing equipment

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CVD diamond laser microprocessing machine

Over 1,000 units introduced. Achieving high-precision cutting, shape cutting, slicing, and marking. Sample processing consultations are currently being accepted.

The "DCS Series" is a laser fine processing machine equipped with wavelengths, pulse widths, and output energy that can precisely cut, shape, slice, and mark CVD diamonds. It is utilized in countries around the world, with over 1,000 units installed. It is used in processes such as tool edge processing and the precise polishing of semiconductor wafers. 【Examples of Applications】 ■ Tool edge processing ■ 4P diamond three-dimensional shape processing ■ Internal marking ■ Polishing of diamond wafers *For more details, please refer to the materials available for download in the catalog. We are also accepting inquiries for sample processing. Feel free to contact us.

  • Other processing machines

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Nanosecond laser micromachining device

Compact-sized laser microfabrication machine

We will integrate various lasers and optical systems into a Class 1 compliant safety enclosure according to the application. We can provide proposals while confirming the laser oscillator type and precision requirements through sample processing.

  • Wafer processing/polishing equipment

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AOC2000 Nanosecond, Picosecond, and Femtosecond Laser Microprocessing Device

High-precision laser micro-machining machine

We will integrate your desired laser processing optical system into a compact platform.

  • Wafer processing/polishing equipment

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