Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 25 items
Slab-type solid-state laser fine processing equipment IS / BX / HD series
Edgewave Inc. 【Features】 ○ Output: IR 100W, Green 40W ○ Short pulse: 5–10ns ○ Beam shape: Gaussian, square, line ○ Glass substrate straight hole processing ● For more details, please contact us or download the catalog.
This is an introduction to examples of processing techniques for ultra-fine metal pipes, including one-sided through-hole machining, porous machining, slitting, groove machining, spiral groove machining, and notch machining.
It has become possible to perform various fine processing on thin, ultra-fine metal pipes that were previously unable to be processed due to deformation from external forces with contact tools and thermal effects with conventional thermal processing lasers. By using a rotating mechanism, it is possible to carry out processing in all rotational directions.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: Glass with ITO film Film thickness: 90nm / Removal width: approximately 20μm / Pattern size: approximately 5mm x 5mm At Higashi-Nari Electro Beam Co., Ltd., we utilize precision laser processing for fine drilling, cutting, groove processing, and more. Selection of laser wavelengths (IR, SHG, THG) is available. We can accommodate various materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resin materials. Please feel free to consult with us. [Features] ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Drilling of holes less than 100μ For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: Cobalt alloy Pipe diameter: φ (phi) 1.55mm / Wall thickness: 100μm / Cutting width: approximately 40μm / Remaining width: approximately 50μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for precision processing, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can work with a variety of materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. [Features] ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production of one piece to mass production.
Material: Cobalt alloy Pipe diameter: φ (phi) 1.55mm / Wall thickness: 100μm / Cutting width: approximately 40μm / Remaining width: approximately 20μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for microfabrication, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. The materials we can work with include various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins, among others. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for precision hole drilling and micro cutting processing, from prototype production to mass production.
Material: Tungsten Plate thickness: 50μm / Hole diameter: φ (phi) 300μm At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for precision processing, offering services such as fine hole drilling, cutting, and groove processing. You can choose from various laser wavelengths (IR, SHG, THG). We can work with a wide range of materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μm For more details, please contact us or download the catalog.
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: SKD11 Processing diameter: φ (phi) 30μm / Processing depth: 15μm / Processing pitch: 50μm / Number of processes: Approximately 360,000 locations At Higashi-Nari Electro Beam Co., Ltd., we utilize laser technology for micro-machining, offering services such as fine hole drilling, cutting, and groove processing. Selection of laser wavelengths (IR, SHG, THG) is available. We can accommodate various materials including various types of stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult with us. 【Features】 ○ Suppression of burr generation in metals ○ Suppression of thermal sagging in resin materials ○ Hole drilling below 100μ For more details, please contact us or download the catalog.
![[Prototype Acceptance in Progress] Examples of Laser Microfabrication Applications](https://image.mono.ipros.com/public/product/image/e60/2000156206/IPROS6108904142426905709.jpg?w=280&h=280)
We will respond to your prototype requests with cutting-edge laser microfabrication technology, providing high-quality processing that includes three-dimensional shapes.
Hikari Corporation is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the general agent in Japan. We have introduced 3D-Micromac's picosecond laser microprocessing equipment within Hikari Corporation. With this cutting-edge laser microprocessing equipment, we will respond to your prototype requests. We achieve high-quality processing for hole drilling, cutting, and marking, regardless of the material being processed. 【Application Examples】 ■ Metals: Micro hole processing, fine groove processing, thin film removal, marking, fine engraving, fine cutting ■ Ceramics, Glass, etc.: Fine engraving, fine cutting, marking, micro hole processing, laser lift-off ■ Resins: Micro hole processing, fine cutting, fine groove processing, coating removal For more details, please contact us or refer to our catalog.
[Laser Micromachining Examples] Hole Processing Examples for Ceramic, Stainless Steel Plates, and Polyimide
Introducing three examples of micro-hole processing! You can also view processing photos from the left. ■ Hole processing of Φ1 mm in ceramic It can be seen that a vertical hole without taper has been made in a 1 mm thick ceramic (AlN). Additionally, there is no thermal impact, resulting in very clean edges. ■ Inverted taper hole processing This is a cross-section view of the hole processing results. Holes were processed in a 1 mm thick stainless steel plate. The photo shows the results of laser processing from left to right. The taper is controlled, resulting in an inverted taper on the laser emission side of the hole. ■ Hole processing of polyimide This is the laser entry side. Holes with a diameter of 25 µm have been processed. The edges are very clean, and there is almost no thermal impact. The material is 25 µm thick polyimide. This is applied to inkjet nozzles, processing over 1,000 holes per head. For more details on various examples of laser processing, please download and view "Case Studies on the Introduction and Problem Solving of Laser Microprocessing Machines Vol. 1" from the link below.
[Laser Micromachining Examples] Polyimide, Ultra-Fine Hole Machining, and Hole Machining Examples on Stainless Steel
Here are three examples of micro hole processing! You can also view processing photos from the left. ■ Hole processing of polyimide This is the laser emission side in the left photo. The reverse taper (the hole diameter on the emission side is larger than that on the incident side) is controlled at 13°. Positioning accuracy of ±250 nm and repeatability of ±250 nm have been achieved. ■ Ultra-fine hole processing A hole of approximately Φ10 µm was processed using a laser on a metal plate with a thickness of 100 µm. There is no thermal impact, resulting in a very clean round hole. Such high aspect ratio laser microprocessing is also possible. ■ Hole processing on stainless steel This is hole processing on 100 µm thick stainless steel SUS430. A fine hole with a diameter of Φ35 µm can be processed using a laser. It is also possible to create a mesh structure with multi-hole processing without distortion due to heat. For more details on various examples of laser processing, please download and view "Laser Microprocessing Machine Introduction & Problem Solving Case Collection Vol. 1" from the link below.
[Laser Micromachining Examples] Mesh processing of stainless steel, dimple processing on brass.
Introducing two machining examples related to high-speed fine multi-hole processing! You can also view processing photos from the left. ■ Mesh Processing of Stainless Steel We created a mesh structure by machining through holes with a diameter of Φ30µm at a pitch of 50µm in stainless steel SUS430 with a thickness of 100 µm. The number of holes exceeds 80,000. The processing speed is 0.25 seconds per hole. It is possible to arrange the holes in a staggered pattern, as well as in a grid layout as shown in the photo. Additionally, larger area mesh processing is also possible. Since we are scanning the laser spot to create holes, we can achieve various shapes of holes, including round, elongated, square, and triangular holes. ■ Dimple Processing on Brass This processing involves arranging stop holes with a diameter of Φ30µm and a depth of 15µm at a pitch of 40µm. The laser can process not only through holes but also stop holes. We can produce more than 30 dimples per second. The pitch and depth can be freely set. While some lasers cannot process brass, 3D-Micromac has the know-how to process it based on years of experience. *For more details on various other examples, please download and view "Laser Fine Processing Machine Introduction & Problem-Solving Case Study Collection Vol. 1" from the link below.
[Laser Microprocessing Examples] Examples of Y-shaped and C-shaped hole processing, and grooved round hole processing.
Introducing four machining examples related to precision shape cutting! You can also view processing photos from the left. ■ Y-shaped hole machining Holes can be drilled into stainless steel plates thicker than 500 µm while controlling the taper. This is from the laser entry side. The processing time was 100 seconds. 3D-Micromac excels at machining irregular holes while controlling the taper. ■ C-shaped hole machining The hole shape is completely customizable. This shows the laser exit side. We respond to strict dimensional tolerance requirements with precise laser processing. It is gaining attention as an alternative to wire electrical discharge machining (EDM). ■ Y-shaped hole machining Y-shaped holes are being machined into a 500 µm thick stainless steel plate. This is a SEM photo from the laser entry side. The groove width is 50 µm. The edges are sharp. ■ Grooved round hole machining We are machining round holes with grooves. It is possible to cut out freely shaped designs like this. It has received high praise as a highly productive device. For more details on various other examples, please download and view "Laser Microprocessing Machine Introduction & Problem-Solving Case Collection Vol. 1" from the link below.
For processing such as glass drilling, glass scribing, hard material groove processing, and Si scribing!
Our laser microprocessing machine, the 'LP Series', is a device capable of high-speed processing over a wide area, thanks to the combination of a galvanometer scanner and a high-precision XY stage. With the incorporation of a coaxial observation system, it allows for high-resolution processing observation. Additionally, it can accommodate various types of laser oscillators. 【Features】 ■ High precision, high-speed processing, and high value-added processing ■ Compatible with laser oscillators suitable for processing purposes ■ XY stage processing, galvanometer scanning processing, and combined XY stage/galvanometer processing ■ Customization options tailored to processing applications ■ Suitable for both experimental processing applications and production equipment *For more details, please download the PDF or feel free to contact us.
It is a compact excimer laser micromachining device that can be installed on a tabletop.
By using an excimer laser, which operates at ultraviolet wavelengths, excellent processing quality can be achieved. It is effective for processing polymer resins, thin films, metal films, and glass materials.
Excimer laser fine processing equipment LB1000/1500
Compatible with small to large excimer lasers, fixed reduction projection magnification of 4 to 18 times, customizable devices with a variety of options. 【Features】 ○ Customization possible with a variety of optical system options ○ Easy installation and modification of options as needed ○ Reduction projection magnification can be set between 4 and 18 times ○ Observation system with real-time monitoring ○ User-friendly operation with multifunctional software ○ Dedicated options can be remotely controlled from a PC ○ Standard 200×200mm XY stage ○ Compatible regardless of the size or manufacturer of the excimer laser ○ Usable with excimer lasers already owned ● For more details, please contact us or download the catalog.
