Precision sheet metal processing products
Semiconductor device partition plate
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.6mm. The main processes are punching, pre-processing, bending, and spot welding in that order. After forming, trivalent chromate plating is performed, studs are inserted, and final inspection takes place. This product is used as a partition plate for semiconductor equipment. The production time, including plating treatment, is approximately 2 to 3 days for a lot of 100 units.
- Company:東開製作所
- Price:Other