1～2 件を表示 ／ 全 2 件
Wafer Mask Sheet Spin Cleaning Device
It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.
A sheet multi-spin processor that accommodates complex process needs with multiple chamber configurations!
We would like to introduce the "Sheet-type Spin Cleaning Device" that we handle. The work size ranges from Φ2" to 12" wafers or square substrates (up to a maximum of 600mm□). No setup changes are required for size adjustments. In the automatic type, when the cassette is set in the loader, the clean robot transports the workpiece and automatically performs chemical treatment, rinsing, and spin drying. In the manual type, the workpiece can be manually set in the chuck, and the same processes can be carried out. 【Specifications (partial)】 ■ Work materials - Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, SUS plates, etc. ■ Chemical tanks: Chemical supply tanks and waste liquid tanks can be built into both sides of the main unit. ■ PVA disk brush can be installed. *For more details, please download the PDF or feel free to contact us.
