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After curing, it provides a high-efficiency thermal interface without air gaps.
It is a two-component mixed type thermal conductive gap filling material. Since it can be applied with a dispenser, it offers high freedom of shape and does not put stress on components or substrates during assembly.
Thermal management for miniaturized electronic components! Conducts heat with low load and low stress even on steps and rough surfaces.
The BERGQUIST GAP PAD TGP HC5000, which has improved thermal conductivity, has been introduced to the GapPad series, ideal for thermal management of electronic components and substrates. With a thermal conductivity of 5.0 W/m·K, this product has high conformability and excellent wettability, allowing it to efficiently conduct heat even on uneven surfaces and rough textures. Additionally, its low compression load minimizes stress on components and substrates during assembly. 【Features】 ■ Easy-to-handle sheet with high filling capability ■ Excellent thermal properties even under low loads ■ Reduces joint temperature, contributing to improved device performance *For more details on the GapPad series, please refer to the catalog.
