Lead frame appearance inspection device
Achieving automatic visual inspection of lead frames and die bond chips! Compatible with high-resolution inspection!
This is an automatic visual inspection device for lead frames capable of high-precision 2D defect inspection. In addition to lead frames, it can also inspect defects on die-bond chips on the lead frames. You can choose from high-resolution inspection-compatible cameras ranging from 4M to 25M pixels, and it enables high-precision 2D defect inspection with multi-angle LED lighting and multiple image captures. It reliably detects various defect modes. 【Features】 ■ Supports inline inspection ■ Maintains a clean environment inside the device with downflow from a clean fan ■ Outputs inspection results using MAP data *For more details, please refer to the PDF document or feel free to contact us.
- Company:日精 本社
- Price:Other