Conference materials: Design and Measurement for High-Speed Signals
ET-WEST 2013 Conference Materials: Design and Measurement for High-Speed Signals
ET-WEST2013 (Embedded Comprehensive Technology Exhibition) Conference Materials [Design and Measurement for High-Speed Signals - Utilizing Actual Measurements and Simulations] In high-speed signals such as USB 3.0 and PCI Express, the effects of attenuation and reflection in circuit board patterns become significant, leading to what is known as signal integrity issues. Understanding signal integrity issues is effectively supported by circuit board simulations. Additionally, actual circuits employ circuit technologies to compensate for such attenuation, and these circuit technologies must also be reflected in signal evaluations. This session will provide an overview of the current state related to design and measurement. Speaker: Yoshiki Tsuji Teledyne LeCroy Japan Co., Ltd. Department Manager, Technical Department
- Company:テレダイン・レクロイ・ジャパン
- Price:Other