トーヨーコーポレーション List of Products and Services

This is a next-generation metal mask that achieves high-quality solder paste printing by generating a special resin on the metal surface (P surface and opening cross-section).

• Printed Circuit Board

The issues of storage space and reduction of work time associated with the combination metal mask.

• Printed Circuit Board

We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

• Printed Circuit Board

We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjust carrier specifications, and specifications with angle adjustment functions!

• Printed Circuit Board

We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

• Printed Circuit Board

Various specifications are available, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

• Printed Circuit Board

We offer a variety of specifications, including fine processing specifications, parts, specifications with substrate holding functions, bridge killer specifications, and adjustable carrier specifications, among others. This is a dip pallet processed using a super high heat-resistant material called CDM. - After inserting the parts, set them on the carrier. ↓ - Solder will only attach to the opening of the carrier. ↓ - Soldering is complete. 【Features】 ■ Can accommodate cases requiring fine processing. ■ Equipped with spring pins for parts and substrate holding, allowing for smooth substrate setup and reducing time costs. ■ Ideal as an item when bridges cannot be eliminated. ■ Multiple substrates can be set and fed into the flow layer. No need for flow line width adjustment, making changeovers smooth. ■ With angle adjustment functionality, it can be adjusted to optimal soldering conditions. It rotates 360 degrees, allowing for condition setting with a single carrier. *For more details, please download the catalog or feel free to contact us.

• palette
• Printed Circuit Board

The "Magnesium Alloy EX Palette" is made of magnesium alloy, making it a product with superior thermal conductivity compared to aluminum. It is suitable as a jig for aligning chip components or for thin substrates. Orders can be placed starting from one piece. 【Features】 ■ Ideal for mounting flexible and thin substrates (ultra-high precision machining possible with NC cutting) ■ Minimal warping and distortion during processing, allowing for high-precision printing ■ Easy temperature management in reflow ovens (1.3 times the heat absorption and dissipation characteristics compared to aluminum) ■ No warping or shape changes due to thermal cycles, providing excellent durability *For more details, please refer to the PDF document or feel free to contact us.

• palette
• Printed Circuit Board

The "Magnesium Carrier" enables ultra-high precision machining through NC cutting and is suitable for high-density mounting. By pulling the substrate with a tension mechanism and fixing it to the carrier, it also has the effect of correcting warping. By installing a removal jig, the substrate pulling mechanism is pushed back, allowing for removal without applying stress to the substrate. (It can also be used during substrate installation.) 【Features】 ■ The bottom surface has no R or taper shape, preventing play in components and substrates. ■ Burrs and machining warping are minimized, allowing for high-precision printing. ■ With a heat absorption and dissipation characteristic 1.3 times that of aluminum, temperature management in the reflow oven is easy. ■ Compared to other metals, it minimizes warping and shape changes due to thermal cycling. ■ Excellent durability. *For more details, please refer to the PDF document or feel free to contact us.

• palette
• Printed Circuit Board

The "magnesium transport carrier" is made of magnesium alloy, which has superior thermal conductivity compared to aluminum.

• Printed Circuit Board

The "CDM-ESD" is a product that demonstrates high performance in high-temperature environments above 300°C. It can also be used as a processing material for mechatronic components. "CDM" is a composite material made of glass fibers and resin structures with high mechanical resistance values. It was developed as a raw material for rapid and accurate substrate insertion jigs. 【Features】 ■ Electrostatic countermeasure material - Surface resistance value: 10^5 to 10^9 Ω/□ ■ Low deformability ■ High dimensional stability ■ Excellent solvent resistance ■ Not subject to RoHS directive *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Processing Jig
• Other cutting tools

Thin substrates: For issues such as unstable printing and mounting below 1mm!

• Inspection fixture
• Processing Jig

The "Printed Circuit Board Surface Cleaning Machine (Inline Type)" is a cleaning machine specially developed for SMT lines. It can clean even when chip components are mounted on the underside of the board. It comes standard with powerful static eliminators at both the entrance and exit, preventing dust from adhering to the cleaned board due to static electricity. 【Features】 ■ Prevention of defective products ■ Quality improvement ■ Easy operation *For more details, please refer to the PDF document or feel free to contact us.

• Other painting machines
• Other cleaning machines
• Other processing machines

The "resin sheet" is a product that can be easily cut with scissors or a cutter. Since it has an adhesive, it can be applied as needed to the desired areas, allowing for cost reduction. It can be applied to your current carrier. By using heat-resistant glass epoxy material for the core, it can be applied and will conform to the unevenness on the back side of the FPC. 【Features】 ■ Durability: Can withstand over 500 reflow cycles ■ Maintenance is simply done by wiping the surface with IPA or ethanol *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Other cutting tools

The two-fluid cleaning technology that uses only water and air requires no solvents at all.

• Other cleaning machines