テクノアルファ List of Products and Services

The "FALCON Series" is a die flip chip die bonder that offers a lineup of devices tailored to user needs, ranging from manual to automatic specifications. We can manufacture die flip chip bonders according to your company's required specifications by combining various options. We can propose devices suitable for your specifications, including heating mechanisms, high-load bonding, wafer pickup, and chip flipping functions. Additionally, there are higher models that can accommodate fully automatic specifications with attachments like conveyors, and since these are our own products, we can flexibly respond to your desired customization specifications. 【Features】 ■ Operability Achieves smooth XY stage operability using a joystick. Basic operations can be completed easily with the joystick, providing simple operation specifications. ■ Load Control Supports applications requiring advanced load control through program operation by a motor (Z-axis resolution in micrometers) and VCM control (optional). ■ Software User interface design that does not require a manual. User-friendly specifications that allow for easy setting of bonding parameters and recognition program creation. *For more details, please download the PDF materials.

Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.

The K&S manufactured wire bonder and ribbon bonder ASTERION adopts the latest beltless direct drive motion system, significantly improving productivity (UPH) compared to conventional models, and is a new type of wire bonder with enhanced newly added features. ASTERION has expanded the bonding area, incorporated advanced pattern recognition, and strengthened tight process control. This has improved high productivity, bond quality, and reliability. The enlarged bonding area accommodates various applications and reduces line integration costs. 【Features】 <Productivity> - The expanded bonding movable range (300mm x 300mm) shortens index/loading time. - Enhanced pattern recognition improves MTBA. - Cycle time reduction through pattern recognition with a new mode and direct drive motion system. <Performance> - Minimal frame movement and increased frame rigidity reduce the vibration of the machine during operation. - Repetitive accuracy of bond positioning. - Improved process stability.

Introducing the PowerFusion wedge bonder manufactured by K&S, handled by Techno Alpha. PowerFusion is a fully automatic wedge bonder for lead frame package devices, featuring the latest beltless direct drive motion system and a high-performance image recognition system, significantly improving productivity (UPH) and reliability compared to conventional models. Additionally, it offers a bond head configuration ranging from a single head type to a maximum of six heads, allowing for high productivity tailored to application needs and enabling line changes as necessary. 【Features】 <Productivity> - UPH increase: Adoption of direct drive servo system and high-speed image recognition system - MTBA increase: Enhanced uptime due to high-performance image recognition system <Performance> - Customizable loop profile - Improved bond position repeatability - Reduced damage to lead frames through the use of an input kicker with adjustable overload settings <Advanced Package Compatibility> - Support for small power devices - Expanded bond area - Improved indexing accuracy

This is a multi-focus X-ray fluoroscopy and CT device capable of switching between nano, micro, and high-power modes depending on the application, featuring a high-quality multi-shot mode, an automatic inspection mode through teaching, microCT for electronic components (orthogonal CT function), and micro3D for mounted circuit boards (oblique CT function), as well as a reflow simulator option (exclusive to Cheetah), making it versatile for a wide range of applications. 【Features of the X-ray Inspection Device】 ◆ Exceptional expressiveness with a high-sensitivity 16-bit (65,536 gradation) flat panel detector ◆ Equipped with in-house developed X-ray tubes that support nano-focus mode, micro-focus mode, and high-power mode for various applications ◆ Effective for not only electronic components but also resin parts, rubber parts, metal parts, and various other applications ◆ Capable of equipping orthogonal CT/oblique CT options ◆ Capable of equipping reflow simulator options (compatible with Cheetah EVO) 【Specifications】 ・FeinFocus X-ray generator: 　Select from micro-focus type FXT-160.50 or multi-focus type FXT-160.51 　Tube voltage 20-160 kV Please refer to the PDF for more details.

The "Asterion-EV" is a hybrid wedge bonder equipped with an expanded bonding area, intelligent pattern recognition capabilities, and rigorous process control. Based on a redesigned architecture, it combines these features to enhance productivity, bonding quality, and reliability. Additionally, it is equipped with a built-in wire feed system that operates in sync with the bond head, allowing for continuous operation at room temperature without applying heat. 【Features】 ■ The expanded bonding area improves flexibility ■ Contributes to reduced line integration costs ■ Achieves high productivity ■ Simplifies programming and optimization of bonding processes for complex devices *For more details, please download the PDF or feel free to contact us.