テクノアルファ List of Products and Services

Fluke Process Instruments (formerly Datapaq) has developed a new temperature logger system ideal for localized jet soldering (selective soldering). By adopting micro-plug thermocouples, it achieves a compact size, making it suitable for use in furnaces with limited installation space. In addition to measuring product temperature, it uses specially designed sensors to measure solder jet and preheat atmosphere temperatures, which can also be utilized for managing the furnace's condition at startup. The dedicated software, which supports Japanese, allows for analysis and pass/fail determination of maximum temperature, heating and cooling gradients, time required to reach specific temperatures, time above a certain temperature, and solder jet contact time, among other parameters. A heat-resistant case for reflow is also available.

The basic model of the latest Sigma from Dutch company XYZTEC. By simplifying some specifications and options, we have managed to keep the initial introduction price low, while still allowing the use of the comfortable rotary measurement head (which can accommodate up to 6 types of sensors). It is also possible to propose a single-function head specification dedicated to pull tests/shear tests, and it can accommodate functional expansions after installation. While wire pull tests can be performed manually using tension gauges, variations in measurement values and failure modes can occur due to individual differences among operators. By using a bond tester, measurement variations can be eliminated, allowing for more accurate detection of product defects, and reducing uncertainties in troubleshooting during defect occurrences.

German Pfarr Company manufactured Pb-free solder/low melting point solder/molding solder All processes of metal melting, alloying, and molding are conducted in-house. Therefore, we deliver high-quality products through strict quality control. - Supports 176 types of alloys with melting points ranging from 13 to 1770°C, including lead-free and leaded options - Excellent size tolerance - High quality recognized by major semiconductor manufacturers in Europe and the U.S. due to vacuum refining and high purity (standard purity 99.99%) - Flexible response to custom dimension products through unique processing technology - Over 1000 types of molds and pools - Rich lineup of alloys compatible with Pb-free requirements - Also supplies low melting point bismuth (Bi) and tin (Sn) based alloy solder

Thermoplastic resins have the property of softening when heated to a specified temperature and then hardening when the temperature decreases. STAYSTIK adhesive is an adhesive that utilizes this characteristic of thermoplastic resins. Since no curing accelerators are added like in thermosetting adhesives, it is physically stable and allows for long-term storage at room temperature. Additionally, it softens upon heating, making rework after adhesion easy. 【Features】 - Extremely low outgassing levels - Reworkable (can be peeled off with solvents or heat) - Can be stored at room temperature for one year - Available in two types: paste type and film type - Three types: conductive, thermal conductive (electrically insulating), and insulating - The paste has minimal "bleeding" during curing (heating) - The film type and paste can be bonded with short-term (seconds to minutes) heat pressing after B-stage - High reliability conforming to military standard MIL-STD-883, 5011/2 - Stress relief achieved with low elastic modulus - Compliant with RoHS directive - PFAS-free

We would like to introduce our company's "Reflow Equipment." We handle various products, including the SST Corporation's "Vacuum and Pressure Reflow Equipment," which is suitable for process development and small-scale production of microelectronics packages, as well as the "Model 5100," which can automatically control precise heating and cooling settings, and the "VPS Reflow Equipment," which can accommodate 3D mounting and three-dimensional structures. 【Products We Handle】 ■ SST Corporation's Vacuum and Pressure Reflow Equipment ■ IBL Corporation's VPS Reflow Equipment *For more details, please refer to the PDF materials or feel free to contact us.

At Techno Alpha, we handle the 'VPS Reflow Equipment' manufactured by IBL and R&D Vaportech. In the VPS method, products are immersed in a saturated vapor atmosphere obtained by heating a fluorinated inert heat transfer liquid (Garden), allowing the vapor that comes into contact with the product to release latent heat of vaporization and condense, enabling efficient and uniform heating of the product. This method is also effective for substrates with three-dimensional components, thick large substrates, and 3D mounting. 【Features】 ■ The vapor temperature is determined by the boiling point of the liquid used, allowing for uniform application of a constant temperature to the product. ■ Since the boiling point temperature of the liquid is utilized, the product is not exposed to temperatures above the specified temperature (= boiling point temperature), minimizing damage. ■ Because it uses vapor, it has higher thermal efficiency compared to hot air and infrared methods, improving mass production through reduced process time. *For more details, please refer to the PDF document or feel free to contact us.

The "Model 5100" is a batch-type vacuum pressure reflow device manufactured by SST Vacuum Reflow Systems. It allows for automatic control of heating and cooling settings with high precision. The uniquely designed IR heater uniformly heats the entire process area while providing temperature feedback control in the process area. It is suitable for mass production of flux-free and void-free soldering for microelectronics packages and electronic components. Additionally, it has a proven track record in glass-metal bonding for RF power devices, crystal devices, image sensors, and in hermetic sealing, vacuum sealing, and lid sealing using eutectic bonding for aerospace and high-end industries. 【Features】 ■ Achieves flux-free and void-free soldering ■ Maximum temperature of 500℃ ■ Vacuum level of 10-5 torr (10-3 Pa) ■ Maximum chamber pressure level of 40 psig (3.7 bar, 0.37 MPa) ■ Realizes precise heating and cooling control ■ Equipped with a system that can optimally control temperature, vacuum, and pressure *For more details, please refer to the PDF materials or feel free to contact us.

SST is a global leader providing solutions and equipment for microelectronics assembly processes. We perform high-precision pressure management, including pressurization with vacuum and process gases, and offer solutions for processes such as voidless soldering, brazing, glass sealing, high-density sealing, moisture getter activation treatment, and wafer bonding.

This model was developed at the request of a major European power module manufacturer for measuring the shear strength of ultrasonic metal-joined power module terminals, busbars, and large-area die shares, with a shear strength exceeding 200 kgf. With a dedicated design for high load capacity, it achieves high robustness with a deflection of 100 μm under a load of 1000 kgf and a measurement accuracy of ±1%. The shear sensor is compatible with Θ rotation, allowing various directional shear tests without rotating the sample. It supports automatic measurement through an automatic measurement function with position correction via image recognition. Even during manual measurements, easy alignment is possible using a camera. It is also equipped with a function for recovering test fragments (terminals). With the optional Halcon image processing function, it can accommodate various measurements and advanced recognition through image processing. The recent renewal has achieved even higher positional accuracy and rigidity by adopting a granite chassis, and the software has also been improved. The cabinet complies with SEMI S2 standards, ensuring comprehensive safety measures.

The Dutch company XYZTEC's bond tester Sigma can freely combine and mount up to six types of load cells (sensors) on its rotating head. With this single unit, it supports pull and shear tests for gold wire, pull, shear, and tweezer pull tests for aluminum wire, and pull shear tests for Al ribbon wire. There is no need for operators to change load cells (cartridges) or set range switches. This reduces work time and prevents accidents from dropping or damaging load cells. Additionally, its smooth stage operation, wide range of motion, automatic pull hook rotation function, and shear sensor's Θ rotation mechanism significantly enhance work efficiency. The utility requirement is only 100VAC (no compressed air needed). It has a proven track record of deliveries to many major semiconductor manufacturers both globally and domestically.

The latest model from Dutch company XYZTEC. Equipped with a rotary head capable of accommodating six sensors, it boasts excellent operability, measurement accuracy, and multifunctionality, overwhelming competitors and achieving high cost performance. The rotary measurement head, high-speed operating stage, and rotary share sensor contribute to reduced work time. It also comes standard with a simplified pattern recognition automatic measurement function. By adding an optional image processing function, it can support more advanced automatic measurement and automatic recognition of failure modes. It has been widely adopted by major semiconductor, power device, and various electronic device manufacturers in Japan and around the world.

This is a temperature monitoring system (temperature logger) manufactured by Fluke Process Instruments, a company specializing in temperature measurement loggers (formerly Datapaq). By housing the temperature logger in a heat-resistant case, the system can be introduced into the furnace. This allows for the measurement object to be transported within the furnace together with the logger, eliminating the need to extend thermocouples from the measuring device outside the furnace. Temperature measurement has become easier in long reflow ovens and vacuum reflow furnaces where it is impossible to discharge thermocouples outside the furnace.

This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.

Diener’s atmospheric pressure plasma device creates a high-voltage field at the electrode part of the plasma nozzle, which ionizes the gas passing through it. This plasma is then irradiated into the atmosphere using an air stream, allowing for the cleaning and hydrophilicity improvement of target products. By using compressed air instead of argon or helium gas as the gas source, it also enables a reduction in running costs. Diener’s innovative product, PlasmaBeam RT, is an atmospheric pressure plasma device ideal for high-speed, high-efficiency, and extensive inline plasma treatment of two-dimensional surfaces. PlasmaBeam RT can be easily integrated into existing production lines, enabling automatic cleaning and activation of various parts and materials. It features two complementary arranged nozzles that rotate at high speed during operation, allowing for a plasma treatment width of up to 120mm with the stable quality and effectiveness of Diener’s atmospheric pressure plasma system.

Diener Electronic GmbH, established in 1993, offers a wide range of plasma cleaners, from small models for research and development and low-volume processing to large processing machines. Diener's atmospheric pressure plasma devices create a high-voltage field at the electrode part of the plasma nozzle, which ionizes the gas passing through it. This plasma is then projected into the atmosphere using an air stream to clean the target products and improve their hydrophilicity. By using compressed air instead of argon or helium gas as the gas source, it is also possible to reduce running costs. *For more details about the products, please download the catalog or feel free to contact us.*