テクノアルファ Product Lineup

German Pfarr Company manufactured Pb-free solder/low melting point solder/molding solder All processes of metal melting, alloying, and molding are conducted in-house. Therefore, we deliver high-quality products through strict quality control. - Supports 176 types of alloys with melting points ranging from 13 to 1770°C, including lead-free and leaded options - Excellent size tolerance - High quality recognized by major semiconductor manufacturers in Europe and the U.S. due to vacuum refining and high purity (standard purity 99.99%) - Flexible response to custom dimension products through unique processing technology - Over 1000 types of molds and pools - Rich lineup of alloys compatible with Pb-free requirements - Also supplies low melting point bismuth (Bi) and tin (Sn) based alloy solder

Thermoplastic resins have the property of softening when heated to a specified temperature and then hardening when the temperature decreases. STAYSTIK adhesive is an adhesive that utilizes this characteristic of thermoplastic resins. Since no curing accelerators are added like in thermosetting adhesives, it is physically stable and allows for long-term storage at room temperature. Additionally, it softens upon heating, making rework after adhesion easy. 【Features】 - Extremely low outgassing levels - Reworkable (can be peeled off with solvents or heat) - Can be stored at room temperature for one year - Available in two types: paste type and film type - Three types: conductive, thermal conductive (electrically insulating), and insulating - The paste has minimal "bleeding" during curing (heating) - The film type and paste can be bonded with short-term (seconds to minutes) heat pressing after B-stage - High reliability conforming to military standard MIL-STD-883, 5011/2 - Stress relief achieved with low elastic modulus - Compliant with RoHS directive - PFAS-free

We would like to introduce our company's "Reflow Equipment." We handle various products, including the SST Corporation's "Vacuum and Pressure Reflow Equipment," which is suitable for process development and small-scale production of microelectronics packages, as well as the "Model 5100," which can automatically control precise heating and cooling settings, and the "VPS Reflow Equipment," which can accommodate 3D mounting and three-dimensional structures. 【Products We Handle】 ■ SST Corporation's Vacuum and Pressure Reflow Equipment ■ IBL Corporation's VPS Reflow Equipment *For more details, please refer to the PDF materials or feel free to contact us.

The "Model 5100" is a batch-type vacuum pressure reflow device manufactured by SST Vacuum Reflow Systems. It allows for automatic control of heating and cooling settings with high precision. The uniquely designed IR heater uniformly heats the entire process area while providing temperature feedback control in the process area. It is suitable for mass production of flux-free and void-free soldering for microelectronics packages and electronic components. Additionally, it has a proven track record in glass-metal bonding for RF power devices, crystal devices, image sensors, and in hermetic sealing, vacuum sealing, and lid sealing using eutectic bonding for aerospace and high-end industries. 【Features】 ■ Achieves flux-free and void-free soldering ■ Maximum temperature of 500℃ ■ Vacuum level of 10-5 torr (10-3 Pa) ■ Maximum chamber pressure level of 40 psig (3.7 bar, 0.37 MPa) ■ Realizes precise heating and cooling control ■ Equipped with a system that can optimally control temperature, vacuum, and pressure *For more details, please refer to the PDF materials or feel free to contact us.

SST is a global leader providing solutions and equipment for microelectronics assembly processes. We perform high-precision pressure management, including pressurization with vacuum and process gases, and offer solutions for processes such as voidless soldering, brazing, glass sealing, high-density sealing, moisture getter activation treatment, and wafer bonding.

This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.