Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.
This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.
Inquire About This Product
basic information
**Features** - High thermal conductivity (higher than typical solder); 70-200 W/m·K. - High adhesion strength to metal lead frame/substrate-based packages using metal dies or bare Si dies, thanks to a unique resin system. - Reliable performance compliant with MSL1 standards. - Ideal for application using large and small needle nozzles or showerhead nozzles. - Minimizes voids in large die packages. - Improved workability for high-density mounting due to no dry-out (long staging time <48 hours). - Adhesion is possible without pressure. - No resin bleed-out, making application easy.
Price information
Please contact us.
Delivery Time
P4
Applications/Examples of results
We have a track record of adoption by domestic and overseas semiconductor manufacturers. 【Package Examples】 QFN SO TO TSSO LGA QFP
catalog（1）
Download All Catalogs
Company information
Our mission at Techno Alpha is to "shine a light on Japanese manufacturing" by creating overwhelming added value. To achieve this, we have set our vision as "the best technology trading company in Japan" and are committed to realizing it. Techno Alpha is a team composed of members with technical backgrounds, including sales, service, mechanical design, electrical design, and software development. Our strength lies in our ability to solve problems from the same perspective and in the same language as our customers, enabling us to provide rapid access to the latest technologies. In this team, we strive to discover cutting-edge technologies from around the world, introduce them domestically, and develop what does not yet exist in the market ourselves. By quickly uncovering the world's leading technologies and developing what is not available, we can support the entire manufacturing industry in Japan. Our team upholds the value of "connecting with the world, honing our technology, and challenging the future," and we will continue to refine our ability to discover products, design and develop, and provide technical services, all in pursuit of creating overwhelming added value that will impress our customers.
