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  3. リプス・ワークス
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リプス・ワークス

EstablishmentMay 2009
capital2500Ten thousand
number of employees18
addressTokyo/Ota-ku/6-4-17 Higashikoujiya, Room 409, OTA Techno CORE
phone03-3745-0330
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last updated:May 18, 2022
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リプス・ワークス List of Products and Services

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Introduction of laser honing processing examples

We would like to introduce a case of honing processing using ultra-short pulse lasers.

Research and development aimed at micro-machining for tribological effects on the inner surfaces of engine cylinder blocks and cylinder liners has been conducted for many years. Representative machining techniques include plateau honing and laser honing. Conventional laser honing has been a high-barrier process due to the need for very advanced optical control technology and expensive equipment. In response to the demand for cylindrical inner surface machining, Lips Works has newly developed a laser honing device! By using a ultra-short pulse laser as the light source, it is possible to perform machining without the generation of burrs or debris, which were challenges in conventional laser honing. Additionally, by pursuing high-speed processing, machining can now be done in just a few minutes per piece with our recommended pattern. The machining range can be customized, whether for the entire cylinder or partial areas.

  • Other Auto Parts
  • Processing Contract

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Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

This is an introduction to a case of micro-fine square hole processing on a tungsten plate with a thickness of 0.1mm.

【Processing Specifications】 Plate Thickness: 0.1mm Hole Dimensions (Incident Surface): 0.3×0.3mm Pitch: 0.6mm Processing Range: 45×45mm You will see that it has been processed in a very beautiful state with minimal thermal impact, without chipping or cracking. The gap between the square holes is approximately 0.015mm or less, making it a good example of the characteristics of short pulse lasers. Tungsten (W) has an extremely high melting and boiling point and is the material with the lowest coefficient of linear expansion among metals. Additionally, due to its very high hardness, it is well known as a material for cemented carbide. However, it is difficult to process, and in machining, there are challenges such as tool wear and chipping, making it particularly regarded as a material that is difficult for fine processing. Nevertheless, there is a high demand for fine processing, and various methods have been repeatedly challenged, but none of the conventional methods were able to achieve the desired shapes. At Lips Works Co., Ltd., we thoroughly explored the appropriate values for optical systems, control systems, laser power, etc., and finally established beautiful fine processing technology for tungsten. There are no concerns about tool wear or breakage, or variations in quality that are seen in machining or other methods.

  • Processing Contract

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Case study of laser microprocessing on ultra-fine metal pipes.

This is an introduction to examples of processing techniques for ultra-fine metal pipes, including one-sided through-hole machining, porous machining, slitting, groove machining, spiral groove machining, and notch machining.

It has become possible to perform various fine processing on thin, ultra-fine metal pipes that were previously unable to be processed due to deformation from external forces with contact tools and thermal effects with conventional thermal processing lasers. By using a rotating mechanism, it is possible to carry out processing in all rotational directions.

  • Processing Contract

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Laser patterning removal processing for thin films.

1. Example of patterning removal processing with a thickness of 0.04 on an aluminum thin film on PET. 2. Example of removal processing with a groove width of 0.03 on a conductive film on a glass substrate.

The laser processing technology, which minimizes thermal impact, enables film removal processing that minimizes damage to the substrate. Since the removal pattern can be changed through adjustments in CAD programming, we can flexibly accommodate requests for pattern changes.

  • Processing Contract

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Proposal for a Laser System

Proposal for a laser system from Lips Works Co., Ltd.

Lips Works Co., Ltd. provides optimal systems tailored to your needs.

  • Other processing machines

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Examples of fine groove processing on PET

This is an example of gradient processing on PET with a minimum width of 20μm to 100μm. Depth control is possible up to 0.5μm.

In laser processing, controlling the depth is difficult, and issues such as dross and smear caused by thermal effects occur, leading to irregular shapes in fine processing. Our company has solved these drawbacks of laser technology.

  • Other electronic parts

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High-precision micro-machining examples for PTFE

This is an example of fine cutting processing on 0.5mm thick PTFE with a 0.2mm square and a 0.4mm pitch using a picosecond laser.

In laser processing, PTFE is known to be processed using carbon dioxide lasers, but fine processing below 1mm has been considered difficult. Our company has solved this challenge with our unique technology and established a fine processing technique for PTFE that results in sharp edges without burrs.

  • Other electronic parts

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Dimple processing examples

Dimple processing for punches, piston rings, and the inner surface of cylinders.

By applying dimple processing to the punch, piston rings, and the inner surface of the cylinder, it is possible to maintain a good sliding environment without experiencing oil film breakage, even under harsh sliding conditions that might otherwise lead to oil film failure.

  • cylinder

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Examples of dimple processing for punches

We achieved dimple processing without introducing dimensional errors to the high-precision machined punch surface.

From the perspective of resource conservation, energy saving, and guaranteeing machine performance, improving the characteristics and friction behavior of friction surfaces is essential. Additionally, the amount and frequency of lubrication in breaking and plastic processing are important from the standpoint of process improvement. Our company has achieved a dimple processing method that serves as a reservoir for oil, enabling continuous processing and lubrication with minimal oil quantity, without introducing dimensional errors to the precisely machined surfaces.

  • Other consumables

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Slit processing for micro pipes

This is an example of spline processing on a thin pipe with a diameter of Φ0.2.

This is an example of spline processing on a thin-diameter pipe with a diameter of 0.2. In regular laser processing, deformation occurs due to the heat generated during processing, making it impossible to maintain the shape.

  • Inspection fixture

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High-precision micro-multi-hole processing case for Ti (tantalum) foil

A multi-hole through processing with a diameter of 0.05 mm and a pitch of 0.5 mm was performed on a tantalum foil with a thickness of 0.05 mm.

In general, machining tantalum is difficult or time-consuming for fine processing, but our company has made it possible to achieve burr-free and highly round fine hole processing through laser machining.

  • Capacitor

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High-Precision Micro-Multi-Hole Processing Case for PI (Polyimide)

We performed multi-hole processing in a staggered grid pattern on a 50μm thick PI (polyimide) with an entrance diameter of Φ17μm, an exit diameter of Φ6μm, and a pitch of 25μm.

Holes were processed in a staggered lattice pattern on a 50μm thick PI (polyimide) with an inlet diameter of Φ17μm, an outlet diameter of Φ6μm, and a pitch of 25μm.

  • Other electronic parts

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Examples of micro-hole processing in fluorine rubber

A through hole with a diameter of 0.084 mm was processed in a fluororubber with a thickness of 0.54 mm. Processing can be done without thermal sagging or splattering of molten material.

A through hole with a diameter of 0.084 mm was processed in fluororubber with a thickness of 0.54 mm. Processing can be done without thermal sagging or splattering of molten material.

  • Other electronic parts

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Case study of micro-hole processing in LCP (liquid crystal polymer) using short pulse laser.

This is an introduction to examples of through-hole processing for LCP (liquid crystal polymer).

A through hole with a diameter of 0.15 mm was processed in LCP (liquid crystal polymer) with a thickness of 0.05 mm. Compared to conventional laser processing, we achieved fine processing with less thermal impact.

  • Other electronic parts

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Examples of precision machining of alumina

Example of processing a Φ40μm through hole in alumina.

This is an example of through-hole processing in alumina using a Φ40μm laser.

  • probe

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High aspect ratio through-hole micro-machining

High aspect ratio through-hole micro machining

For delicate and difficult-to-process silicon wafers, laser processing can be done stress-free. In this example, high-aspect perforation processing was performed on a standard wafer of 0.6 mm thickness using THG-YAG.

  • Processing Contract

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Slitting processing of polyimide film

Slitting processing of polyimide film

It is said that 'there's a way to use anything,' and when it comes to laser processing methods for large open shapes, it's a showcase of skill. In the photo, a spider web shape is being processed with a galvanometer scan, but leaving fine lines without breaking them is quite difficult. We have processing experts in our company.

  • Processing Contract

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