株式会社 産研舎 List of Products and Services

During the machining of sintered bodies, many cracks and chips occur, but we process them using our unique machining method and perform special handling for cleaning and packaging after processing.

This is a sample of ultra-thin wrapping using a 4-way wrapping machine. For more details, please contact us.

Our company offers contract processing services for wafers, including circular and rectangular notching and inch-down processing. We accommodate a variety of materials such as silicon, ceramics, glass, and quartz, and we can also process wafers with orientation flats. Please make use of our services for research and development and prototyping in semiconductor manufacturing equipment. 【Features】 ■ Leveraging nearly 60 years of experience to propose optimal processing methods ■ Support for orders from a minimum of 1 piece to 100 pieces per month ■ Short delivery times, with the fastest delivery within 1 week from order *For more details, please refer to the materials available for download in the catalog. Feel free to contact us with any inquiries.

This is a product that utilizes our cutting-edge programming and 3-axis and 5-axis machining. For detailed information, please contact us.

Our company significantly contributes to the development of the electronics industry through the slicing and lapping processing of materials such as silicon, ceramics, quartz, and ferrite, as well as the manufacturing and sales of auxiliary materials. We perform precision processing of silicon, alumina, glass, Si wafers, and semiconductor compounds using advanced technology and know-how. In particular, we specialize in the processing of unique shapes using silicon. We aim to improve our quality and services daily so that we can continue to grow alongside our customers and advance as a valuable company. 【Business Activities】 ■ Slicing and lapping processing of materials such as silicon, ceramics, quartz, and ferrite, as well as the manufacturing and sales of auxiliary materials. *For more details, please download the PDF or feel free to contact us.

It has been finely processed with a total length of 12mm, with φ0.5 at 5mm, φ0.8 at 3mm, and φ1mm at 3mm. It is also possible to accommodate a silicone rod inside. Since processing from both the top and bottom is required, height management is important and requires considerable ingenuity. Sometimes, specialized jigs are created.

Mainly, we perform drilling processing for wafer inch-down.

Silicon grinding bridge, mortar processing

It is a product with strict precision machining.

Sputtering: Several pieces of tile-shaped silicon are joined together and used as side sputtering.

This is a fixture for processing thin silicon wafers aligned with the surface orientation (notch). It also meets various needs according to the wafer's inch size.

It will be processed by a machining center, but due to the very delicate handling required, special methods will be used for cleaning during processing and after the process is completed, with some tasks being carried out manually. Careful attention will be paid at every stage, and measures will be taken to prevent breakage during packaging, which will be done in specialized containers.

We manufacture silicon crucible testers. Silicon is used for material research due to its low impurity levels. We can process any type of sintered material, including ceramics, glass, and quartz. Please make use of our products for research and development in semiconductor manufacturing equipment and for experimental purposes. 【Features】 ■ Leveraging nearly 60 years of experience to propose optimal processing methods ■ A short delivery system that can deliver in as little as one week from order *For more details, please refer to the materials available for download in the catalog. Feel free to contact us with any inquiries.