ミツバ環境ソリューション List of News Articles

Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder! Our company conducts "X-ray microfocus inspection: X-ray CT imaging." We irradiate the sample with X-rays and rotate it 360 degrees on the sample stage for imaging. This non-destructive method allows for three-dimensional observation of a wide range of products, confirming internal structures and defects. Due to the ease of X-ray penetration, contrast is created based on the constituent elements (density). Additionally, elements with higher density appear bright, while smaller elements appear dark. Please feel free to contact us when you need our services.

Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder! Our company conducts "X-ray microfocus inspection: X-ray CT imaging." We irradiate the sample with X-rays and rotate it 360 degrees on the sample stage for imaging. This non-destructive method allows for the three-dimensional observation of a wide range of products, confirming internal structures and defects. Due to the ease of X-ray penetration, contrast is created based on the constituent elements (density). Additionally, elements with higher density appear bright, while those with lower density appear dark. Please feel free to contact us when you need our services.

The material of the plating can be analyzed and confirmed using EDX! We conduct fracture surface analysis of resin and metal fracture surfaces! Our company performs "fracture surface and cross-sectional observation." In "fracture surface analysis," we have examples from the resin category, such as cracks in polycarbonate and impact fractures in POM parts, as well as cases from the metal category, including fatigue fractures in piano wire and grain boundary fractures. Additionally, in "cross-sectional observation," the results of line analysis at the aluminum wire-solder interface revealed that Cu is diffusing towards the solder dip side. Please feel free to contact us when needed.

Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder! Our company conducts "X-ray microfocus inspection: X-ray CT imaging." We irradiate the sample with X-rays and perform imaging while rotating it 360 degrees on the sample stage. This non-destructive method allows for the three-dimensional observation of a wide range of products, including the internal structure and defects of the sample. Due to the ease of X-ray penetration, contrast is created based on the constituent elements (density). Additionally, elements with higher density appear bright, while those with lower density appear dark. Please feel free to contact us when you need our services.

Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder! Our company conducts "X-ray micro-focus inspection: X-ray CT imaging." We irradiate the sample with X-rays and rotate it 360 degrees on the sample stage for imaging. This non-destructive method allows for three-dimensional observation of a wide range of products, including internal structures and defects. Due to the ease of X-ray penetration, contrast is created based on the constituent elements (density). Additionally, elements with higher density appear bright, while those with lower density appear dark. Please feel free to contact us when you need our services.

The material of the plating can be analyzed and confirmed using EDX! We conduct fracture surface analysis of resin and metal fracture surfaces! Our company performs "fracture surface and cross-sectional observation." In "fracture surface analysis," we have examples from the resin category, such as cracks in polycarbonate and impact fractures in POM parts, as well as examples from the metal category, including fatigue fractures in piano wire and grain boundary fractures. Additionally, in "cross-sectional observation," the results of line analysis at the aluminum wire-solder interface revealed that Cu is diffusing towards the solder dip side. Please feel free to contact us when you need our services.

Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder! Our company offers "X-ray microfocus inspection: X-ray CT imaging." We irradiate the sample with X-rays and perform imaging while rotating it 360 degrees on the sample stage. This non-destructive method allows for a wide range of products to be observed in three dimensions, confirming internal structures and defects. Due to the ease of X-ray penetration, contrast is created based on the constituent elements (density). Additionally, elements with higher density appear bright, while those with lower density appear dark. Please feel free to contact us when you need our services.

Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder! Our company conducts "X-ray microfocus inspection: X-ray CT imaging." We irradiate the sample with X-rays and rotate it 360 degrees on the sample stage for imaging. This non-destructive method allows for the three-dimensional observation of a wide range of products, confirming internal structures and defects. Due to the ease of X-ray penetration, contrast is created based on the constituent elements (density). Additionally, elements with higher density appear bright, while those with lower density appear dark. Please feel free to contact us when you need our services.

The material of the plating can be analyzed and confirmed using EDX! We conduct fracture surface analysis of resin and metal fracture surfaces! Our company performs "fracture surface and cross-sectional observation." In "fracture surface analysis," we have examples from the resin category, such as cracks in polycarbonate and impact fractures in POM parts, as well as examples from the metal category, including fatigue fractures in piano wire and grain boundary fractures. Additionally, in "cross-sectional observation," the results of line analysis at the aluminum wire-solder interface revealed that Cu is diffusing towards the solder dip side. Please feel free to contact us when needed.