Daiwa Fine Chemicals Co., Ltd. Product Lineup

"DAIN TINGOOD S-25" is a 25wt% Sn salt solution with a higher Sn concentration than conventional products. In barrel plating, where the amount of replenishment due to liquid extraction is significant, it reduces the replenishment amount of Sn salt and the cost of waste liquid treatment, thereby lowering the total cost of tin plating. It is possible to mitigate the increase in liquid volume and free acid during metal replenishment. 【Features】 ■ Total cost reduction ■ Liquid volume reduced by half compared to conventional products ■ Higher Sn concentration than conventional products ■ Mitigates increase in liquid volume and free acid ■ Reduces replenishment amount of Sn salt and waste liquid treatment costs (Related keywords: tin plating, Sn, tin salt, organic acid) *For more details, please refer to the PDF document or feel free to contact us.

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This is a highly diffusive vapor-phase rust inhibitor that can be easily applied for rust prevention when temporarily storing steel coils in warehouses or automotive parts on pallets. By placing this product on top of metal products and covering them with plastic or similar materials, rust prevention can be achieved. Since the rust inhibitor in the pack gradually decreases, it is easy to determine when to replace it.

• Rust Inhibitor
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It is a clean and environmentally friendly rust preventive agent for steel materials. - It is a vapor-phase rust preventive agent that suppresses rust simply by being included in the packaging container for storing steel parts. - It uses safe agents that do not require GHS classification pictograms, achieving excellent rust prevention effects while being considerate of human health and the environment. - For rust prevention measures during the transportation of parts and storage of retained items. It allows you to proceed to the next process without cleaning the metal materials.

• Other consumables
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This is a strong acidic non-cyanide electroplating process based on organic acids. It allows for silver plating without etching the resist pattern and direct silver plating on SUS materials. It consists of two processes: strike silver plating and main silver plating. By adjusting the bath composition, it can be applied to various plating methods, including rack plating and continuous plating. Depending on the application, options for a matte white, semi-gloss white, or glossy appearance lineup are available.

• Other consumables
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■ It exhibits strong effects in preventing discoloration of various silver-plated products. ■ It is ideal for surface treatment of electronic components and decorative items. ■ It does not affect the contact resistance or solder wettability of metal surfaces. ■ It forms a water-repellent film without stains or stickiness after treatment. ■ It does not contain heavy metals like chromium or organic solvents, and is not subject to the Poisonous and Deleterious Substances Control Law, the Industrial Safety and Health Law, the Fire Service Law, or the PRTR Law. ■ It is equivalent to thiol treatment.

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This catalog provides an overview of "Metal Surface Treatment Processes." It includes a non-cyanide silver plating process, "Dain Silver EL, RD," which allows for the selection of replacement or reduction types depending on the target material, as well as various stable tin alloy plating processes such as "DAIN TINGOOD 501, DAIN TINSIL SBB VI." Yamato Kasei can propose "new plating processes" that address issues related to plating, such as environmental concerns, improvement of working conditions, and reduction of total costs. [Contents] ■ Non-cyanide silver plating process ■ Lead-free tin plating process ■ Various additives for the same plating ■ Non-cyanide indium plating ■ Zinc-nickel alloy plating and chromate ■ Nano-etching treatment agents for titanium materials ■ Palladium smut removers *For more details, please refer to the PDF materials or feel free to contact us.

• Contract manufacturing

Silver, silver alloys, or silver-plated products are widely used in tableware and jewelry due to their beautiful silver color. Furthermore, they possess excellent electrical properties such as solderability and contact electrical resistance, making them useful as contact materials in electronic components. However, silver generally tarnishes easily, particularly through sulfide formation, changing to yellow, purple, and in severe cases, black. The tarnishing of silver not only detracts from its aesthetic appeal and reduces its commercial value but also adversely affects solderability and contact electrical resistance. New Dain Silver prevents silver tarnishing for an extended period with a very simple room temperature, short-duration immersion treatment. The protective film formed by the New Dain Silver treatment is an extremely thin organic chelate film. The treatment does not alter the appearance of silver or degrade its solderability or contact electrical resistance.

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The Dainakuchi PB-830Z is a silver (Ag) colloid activator used as a catalyst additive for electroless copper plating on various plastics, coating resin films, fibers, and paper. It can be used as an alternative to traditional palladium catalysts, providing adhesion properties equivalent to those of palladium (Pd). Additionally, since there is no residual Pd smut, it prevents issues caused by overflow during subsequent electroless Ni to Au plating after copper plating.

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Automotive, home appliances, and construction materials require excellent corrosion resistance, so they have been treated with hexavalent chromium solution after zinc plating. However, due to the inclusion of harmful hexavalent chromium in the process, it is subject to regulations such as the RoHS directive. Dainchromate TR-02 is a chemical treatment solution primarily composed of trivalent chromium for zinc and zinc-nickel alloy plating. It does not contain hexavalent chromium. When combined with our zinc-nickel alloy plating solution, Dainjin Alloy N-PL, it demonstrates excellent corrosion resistance with white rust resistance for 200 hours and red rust resistance for 500 hours. Additionally, the treatment process is similar to conventional hexavalent chromium treatment, allowing for the direct repurposing of existing equipment.

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Gold-tin alloy shows a eutectic point at an Au/Sn composition of 80/20 (wt%), with a melting point of 280°C. This alloy is non-oxidizing, has good solderability, low resistivity, and improved creep characteristics, lubrication, and wear resistance, making it suitable as a high-temperature joining material for high-frequency devices such as mobile phones, optoelectronic packages, mounted components, optical communication components, as well as for protective element materials, sliding parts, and decorative items. Many gold-tin alloy materials are produced in the form of ribbons or pellets metallurgically, but issues have arisen that make them difficult to apply to narrow pitches associated with high-density mounting. This plating bath allows for barrel plating of micro parts, enabling the production of a uniform eutectic composition plating film.

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Indium (In) is a metal that easily diffuses into various metals and has excellent alkali resistance, with characteristics such as a low melting point (156°C). In plating has good corrosion resistance against organic acids in lubricating oils, and its load-bearing capacity, wear resistance, and seizure resistance are outstanding, making it widely used for surface treatments such as bearings. DAIN IN-161PL is an electroplating solution based on organic sulfonic acid. It produces a uniform and fine-particle white coating. The stability of the plating solution over time is also good, and bath management is easy.

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Traditionally, cyanide complex-based plating solutions have been used for replacement-type electroless plating of silver (Ag), but there have been many issues regarding the working environment and wastewater treatment costs. The Dain Silver EL-3S process is a replacement-type electroless Ag plating solution that contains no cyanide at all and has performance equivalent to that of cyanide baths. It also has a long liquid life and can be applied not only to copper materials but also to electroless Ni-P plated materials. It can be used as an alternative plating for electroless Ni-P/electroless Au plating, which is a coating for soldering printed circuit boards, and by directly plating Ag onto copper circuits using the EL-3S process, it can reduce plating costs. Furthermore, it demonstrates superior reliability in solderability compared to heat-resistant preflux.

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Cyanide silver plating solution has been used for many years due to its usefulness, despite having many issues related to the working environment and wastewater treatment. Dain Silver AG-PL30 is a non-cyanide type of silver plating solution that our company successfully developed and industrialized for the first time in the world. Despite being a plating solution that contains no cyanide at all (not low-cyanide, but non-cyanide), it has performance equivalent to that of cyanide baths. Furthermore, it also surpasses cyanide baths in terms of stability during long-term use and the ability to plate over a wide pH range. As a result of these recognized characteristics, AG-PL30 is used in various applications. Additionally, its purely technical aspects have been highly regarded at academic conferences, and it received the Surface Technology Association Technical Award for the fiscal year 1992 (in collaboration with Osaka Prefecture University).

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