Industrial Machinery

秀和工業

addressTokyo/Adachi-ku/2-32-16 Take no Tsuka
phone03-3883-6022
last updated：
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秀和工業 List of Products and Services

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Shuho Industrial Diamond Slurry

We will manufacture original polishing agents and diamond slurries tailored to your needs.

Lapping diamond slurry has been used for a long time to process ceramics and hard metals with high precision and efficiency.

  • Other consumables

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Semi-Automatic Bonding Machine KBM-150

The bonding process can be performed with a single machine, enabling stable bonding!

In addition to various sizes (φ2 inches, φ3 inches, φ4 inches, φ6 inches), we can also manufacture multiple wafer bonding, such as one, three, or five pieces, according to customer requests. The bonding process is performed with a single machine, which includes (1) heating the carrier plate, (2) applying wax, (3) positioning the workpiece, (4) applying pressure, and (5) cooling, enabling stable bonding.

  • Other machine tools

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Bonding Machine KBM-100 Series

Equipped with a 2-stage independent air cylinder! An air press that also addresses safety concerns!

The bonding machine KBM-100 series is an air press equipped with a dual independent air cylinder.

  • Plastic processing machines (cutting and rolling)

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Single-Sided High-Speed Precision Wrapping Machine SW-07

Achieving high-precision polishing with the adoption of unique machines and equipment!

The SW-07 one-sided high-speed precision wrapping machine features a lap plate that rotates at up to 300 rpm, achieving a reduction in processing time compared to conventional polishing machines through its high-speed rotation mechanism.

  • Special Processing Machinery

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One-Sided High-Speed Wrapping Machine SW-08

With the adoption of the new mechanism, the flatness on the circumference is maintained continuously!

The single-sided high-speed precision wrapping machine SW-08 features a lap plate that rotates at up to 300 rpm, achieving a reduction in processing time compared to conventional grinding machines with its high-speed rotation mechanism.

  • Special Processing Machinery

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Vertical Single-Sided Precision Grinding Machine SW-300

There is no common issue of "flatness deviation of the reference plate" found in grinding machine manufacturers, and the workpiece can always be ensured to be flat without the need for flat grinding technology, making it easy for anyone to secure flatness!

Brittle material substrates (such as sapphire, SiC, GaN, etc.) can be easily polished to a high precision flat surface in a short time.

  • Special Processing Machinery

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Horizontal Surface Grinding Machine SGM-6301

Easy processing with high freshness! Ideal for backlighting of silicon, SiC, and sapphire wafers!

The horizontal surface grinding machine SGM-6301 was developed for easy and high-precision processing of ceramics and difficult-to-machine materials in a short time.

  • Grinding Machine

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Horizontal Surface Grinding Machine SGM-7000A

Ideal for fragile substrates! Achieves low-damage backgrinding of sapphire, GaN, GaAs, SiC, and silicon wafers!

The horizontal flat grinding device SGM-7000A is the ideal equipment for thinly grinding brittle material substrates.

  • Grinding Machine

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Horizontal Surface Grinding Machine SGM-7000

Ideal for fragile substrates! Achieves low-damage backlighting for sapphire, GaAs, SiC, and silicon wafers!

The horizontal flat grinding device SGM-7000 is the ideal equipment for thinly grinding brittle material substrates.

  • Grinding Machine

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Vertical Surface Grinding Machine SGM-8000

Process brittle materials with a hard and fragile substrate to make them thinner, reducing damage from processing changes, and enabling grinding to the thinness of the polishing processing area!

The vertical surface grinder SGM-8000 is a device designed for easily and quickly grinding hard materials (such as sapphire, SiC, GaN, etc.) with high precision.

  • Grinding Machine

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