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The conventional KUMADE CUP type was optimally designed to safely and reliably transport ultra-thin semiconductor wafers (thickness below 50μm). The newly developed KUMADE CUP type maximizes the potential of swirling flow for transporting solar cell/FPD substrates. It achieves high-speed transport of crystalline silicon solar cells with a consumption flow rate of just 15L/min.

• Other conveying machines

Elimination of static electricity and peeling charge, centering during transport to reduce equipment takt time.

• Other conveying machines

Elimination of static electricity and peeling charge, centering during transport to reduce equipment takt time.

• Other conveying machines

Manual tweezers for handling ultra-thin wafers, stress-free on wafers, compatible with small to large diameters, and accessible for wafer cassettes.

• Other conveying machines

The suction force generated by the air ejection nozzle acts on the warped or distorted areas that are away from the hand, drawing them in and holding them to the hand. The force pulling the wafer towards the hand, combined with the friction between the resin pad (made of rubber), stops the lateral movement of the wafer. Therefore, an outer peripheral guide is not necessary, and the hand can hold the wafer without any issues even when inverted.

• Other conveying machines