Innovation supplier for wafer transport and FPD panel transport.
The suction force generated by the air ejection nozzle acts on the warped or distorted areas that are away from the hand, drawing them in and holding them to the hand. The force pulling the wafer towards the hand, combined with the friction between the resin pad (made of rubber), stops the lateral movement of the wafer. Therefore, an outer peripheral guide is not necessary, and the hand can hold the wafer without any issues even when inverted.
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basic information
【Features】 ○ Prevents wafer misalignment with partial contact (contact material: fluororubber) ○ Enables safe and secure transport of thin wafers ○ Capable of attracting warped wafers with significant force ● For more details, please contact us.
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Providing total solutions for ultra-thin wafer transport equipment. Contributing to reduced defect rates and improved takt time through non-contact wafer transport. Enabling the transport of perforated wafers such as TSV (Through Silicon Vias) wafers and MEMS wafers. Supporting the transport of new process wafers such as TAIKO wafers and DBG wafers, as well as the transport of thin wafers requiring backside processing for power devices (Wf surface access).
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