テクノライズ株式会社 Product Lineup

In the production of precision parts such as industrial equipment and electronic components, dedicated jigs and tools are essential. At Technolize Co., Ltd., we provide jigs and tools that enable the pursuit of high precision, stabilization of processes, and labor-saving based on the experience and technology accumulated in various fields. We design and manufacture a variety of jigs and tools to meet the needs of different sectors, including work chuck jigs necessary for polishing processes, fixed-size polishing jigs that enable absolute dimension processing, as well as positioning jigs and stage assembly jigs. ● For more details, please download the catalog or contact us.

• Processing Jig

Grinding micro powder A (fused alumina) is a representative artificial abrasive material made by melting alumina ore in an electric furnace. Grinding micro powder WA (white fused alumina) is also a representative artificial abrasive material made by melting in an electric furnace, similar to material A. Grinding micro powder KOA has fused alumina as its main component, and appears as a brown powder that is very tough. Grinding micro powder GC (green silicon carbide) is a representative artificial abrasive material made by firing quartz and coke in an electric furnace. Grinding micro powder CeO2 (cerium oxide) is a typical abrasive used for glass polishing, with various processing targets including flat glass, glass ornaments, quartz, lenses, and photomasks. ● For more details, please download the catalog or contact us.

• others

Industrial diamonds and CBN abrasives are not only used as raw materials for diamond tools but can also be used as free abrasives for polishing materials. Fine abrasives are used for precision processing of various metals, alloys, glass, semiconductors, etc., while coarse abrasives are used for cutting and polishing rocks such as marble, concrete, and asphalt. In addition to conventional GC and alumina abrasives, they greatly contribute to the manufacturing of precision parts in optical machinery and the automotive industry, as well as current high-tech components. We thoroughly ensure grading accuracy and shape control, and we invite you to try our Technolize diamond powder, which achieves scratch-free results. ● For more details, please download the catalog or contact us.

• others

The TR15M tabletop grinding machine is a standard tabletop grinding device that meets a wide range of requirements from research and development to production. With a variety of options available, it can be customized to accommodate a wide range of applications, from lapping processes for glass, metal, and ceramics to polishing and CMP processes. For more details, please download the catalog or contact us.

• Wafer processing/polishing equipment

The small grinding machine TR06M was developed in response to requests for a simple device for sample grinding and for a compact device due to limited installation space. With a compact size of 350mm x 220mm, it can be installed anywhere and operates on AC100V only. It can process metal parts, glass, wafers, and more, and by changing the grinding plate, it can be used not only for lapping but also for polishing and simple CMP. The grinding methods supported include wet grinding with slurry and dry grinding using grinding sheets. ● For more details, please download the catalog or contact us.

• Wafer processing/polishing equipment

In order to address the demands for fine processing and the diversified ultra-high precision requirements sought in today's processing technology, and to enable further precision pursuit while utilizing the current lap and polish processing line, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process.

• Casting Machine

This is an ideal device for lapping and polishing that requires parallelism of wafers such as crystal, quartz, and silicon, ranging from small 3B to medium 6B and 9B.

• Casting Machine

We provide software suitable for your processing materials, ranging from electronic component materials such as metals and ceramics, optical component materials like sapphire, quartz, and crystal, to CMP processing of semiconductor wafers such as Si and GaAs, and ultra-fine processing for MEMS and more.

• Casting Machine

Each product is classified into various grades, accommodating a wide range of products from general flat glass to ultra-high precision optical lenses, and we can provide a rich supply that covers everything from research and development to mass production. (Main raw material: sourced from Estonia)

• Casting Machine

With the diverse processing know-how accumulated by our company, we respond to all technical needs ranging from lap and polish processing, double-sided processing, edge processing, deposition, cutting, etc. We can accommodate processing quantities starting from just one unit, so please feel free to contact us.

• Casting Machine

Semiconductors installed in various information and communication devices that form a highly information and communication-oriented society are being developed with cutting-edge technologies by various companies. Our company provides essential tools for advanced technology development, including thin wafers of less than 100μm, dummy wafers, various film-coated products for wafers, TEG products, and prober evaluation supplies for various development experiments and equipment evaluations. Additionally, we also perform wafer recycling as a means of resource reuse, so please feel free to contact us. *We have materials for solar cells available.

• Casting Machine

In order to solve various technical issues, we will utilize the technical know-how gained through technical alliances with manufacturers active in each specialized field to support your company's various technical needs from development to mass production.

• Casting Machine

We propose cleaning methods (ultrasonic, brushing, high-pressure jet, chemical solutions, UV, etc.) and drying methods that utilize our technical know-how and technology for semiconductor, secondary semiconductor materials and components, metal parts, etc. * Dirt in fine lines and holes is difficult to remove, and drying is also challenging!! * Watermarks may appear!! * I don't know about cleaning methods using chemical solutions!! Etc.

• Casting Machine

To address the demands for microfabrication and the diversified ultra-high precision requirements sought in today's processing technology, and to enable further precision pursuit while utilizing the current lap and polish processing line, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process.

• Casting Machine

It is ideal for film processing (CMP) of silicon wafers and thin plate processing. There are devices compatible with Low-K films, conductors, and insulating films. Thin plate processing of wafer materials can also be performed separately with an optional device, allowing for the separation of wafers as thin as 30μm and 50μm.

• Casting Machine

Equipped with a tool height control mechanism for the plate correction mechanism (facing mechanism). High-precision flatness management through feedback and free curvature R-surface management are possible.

• Casting Machine

It is ideal for ultra-precision polishing that requires high-precision processing such as magnetic heads, YAG, and lasers. By pursuing the accuracy of factors such as plate surface runout and sliding resistance, it achieves a stable processing rate without applying excessive force to the workpiece, while also eliminating the occurrence of scratches during processing. Additionally, the adoption of a facing mechanism and a circulating water cooling system allows for constant management and maintenance of the plate's flatness. Furthermore, the incorporation of an oscillation mechanism and a forced drive mechanism makes it a lapping device that meets the demands of various fields requiring high precision.

• Casting Machine