Industrial Machinery

ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所

EstablishmentNovember 25, 1991
capital93800Ten thousand
number of employees368
addressKyoto/Muko-shi/1-1 Higashino-kuchi, Morimoto-cho, Nidec Park Building C
phone075-315-8001
last updated：
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ニデックアドバンステクノロジー Product Lineup

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画像検査装置 画像検査装置
自動電気検査装置 自動電気検査装置
光学式検査装置 光学式検査装置
検査用治具 検査用治具
EV向けモーター・インバータ・E-Axle用試験ベンチ EV向けモーター・インバータ・E-Axle用試験ベンチ
光学式検査装置

光学式検査装置

光学式検査装置について

Wafer bump automatic inspection system 'RWi-300MK3'

Ideal for gold bump 3D inspection! Achieves simultaneous measurement of 3D/2D/SD with high speed and high precision.

We would like to introduce our high-speed, high-precision 3D/2D/SD wafer bump automatic inspection system, the 'RWi-300MK3'. The measurement accuracy for 2D/3D has significantly improved, enabling ultra-fast inspections. Additionally, the speed of defect image acquisition has dramatically increased. Please feel free to contact us if you require further information. 【Features】 ■ Simultaneous measurement of 3D/2D/SD achieved with high speed and high precision ■ Suitable for gold bump 3D inspection ■ Diverse transport systems *For more details, please download the PDF or feel free to contact us.

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