Ideal for gold bump 3D inspection! Achieves simultaneous measurement of 3D/2D/SD with high speed and high precision.
We would like to introduce our high-speed, high-precision 3D/2D/SD wafer bump automatic inspection system, the 'RWi-300MK3'. The measurement accuracy for 2D/3D has significantly improved, enabling ultra-fast inspections. Additionally, the speed of defect image acquisition has dramatically increased. Please feel free to contact us if you require further information. 【Features】 ■ Simultaneous measurement of 3D/2D/SD achieved with high speed and high precision ■ Suitable for gold bump 3D inspection ■ Diverse transport systems *For more details, please download the PDF or feel free to contact us.
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.