アドウェルズ List of Products and Services

The standalone ultrasonic metal joining device 'UB050/300/500SA' is a compact standalone ultrasonic metal joining device that is easy to place in production and development sites. With a built-in linear encoder and rigid clamp in the joining head, it accurately controls the position of the joint using a high-rigidity ultrasonic horn unit. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining, and improves joinability by increasing the load with linear pressurization as the joining progresses. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.

The ultrasonic metal joining device 'UB2000/3000/5000LS' is an ultrasonic metal joining device suitable for power devices. The ultrasonic horn is directly clamped by a rigid clamp. This results in the ultrasonic head being highly rigid and compact. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining. The joining capability is enhanced by linear pressurization that increases the load as the joining progresses. 【Features】 ■ High rigidity horn clamp mechanism ■ High precision position control ■ High functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

The ultrasonic seam welding machine 'SB200/400CE' is ideal for the lamination of power device materials and the butt connection of materials. By rotating the joint point, it enables large area welding and allows for continuous welding of roll-shaped materials and other continuous materials. 【Features】 - Achieves large area welding - Enables continuous welding - Equipped with joint quality management functions For more details, please contact us or download the catalog.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

The "UP-Lite1500" is a metal joining device suitable for transitioning from power device development to mass production. This machine is designed as a standalone unit with the premise of being integrated into a mass production system. Development recipes can be directly transitioned to mass production. By adopting a unique rigid clamp method for holding the horn, it achieves high rigidity while maintaining a highly flexible cantilever structure. 【Features】 ■ Suitable for standalone and device integration ■ High rigidity with a highly flexible cantilever structure ■ Integrated joining system with monitoring capabilities ■ Compatible with a wide range of applications *For more details, please refer to the PDF materials or feel free to contact us.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.