アドウェルズ List of Products and Services

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

The ultrasonic seam welding machine 'SB200/400CE' is ideal for the lamination of power device materials and the butt connection of materials. By rotating the joint point, it enables large area welding and allows for continuous welding of roll-shaped materials and other continuous materials. 【Features】 - Achieves large area welding - Enables continuous welding - Equipped with joint quality management functions For more details, please contact us or download the catalog.

The "TB1000MS" is a mass production ultrasonic metal joining device suitable for inverter production. ■ It is suitable for electrode connections in high-temperature inverters and other applications. 【Features】 - Flexible production ⇒ Covers joining conditions suitable for various terminals with a single device - Strong against terminal float ⇒ Starts joining by pressing down on the float with an air servo - Color image processing ⇒ Stable alignment of terminals and horns through color image recognition *For more details, please download the PDF or feel free to contact us.

The "UP-Lite1500" is a metal joining device suitable for transitioning from power device development to mass production. This machine is designed as a standalone unit with the premise of being integrated into a mass production system. Development recipes can be directly transitioned to mass production. By adopting a unique rigid clamp method for holding the horn, it achieves high rigidity while maintaining a highly flexible cantilever structure. 【Features】 ■ Suitable for standalone and device integration ■ High rigidity with a highly flexible cantilever structure ■ Integrated joining system with monitoring capabilities ■ Compatible with a wide range of applications *For more details, please refer to the PDF materials or feel free to contact us.

The standalone ultrasonic metal joining device 'UB050/300/500SA' is a compact standalone ultrasonic metal joining device that is easy to place in production and development sites. With a built-in linear encoder and rigid clamp in the joining head, it accurately controls the position of the joint using a high-rigidity ultrasonic horn unit. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining, and improves joinability by increasing the load with linear pressurization as the joining progresses. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.

The ultrasonic metal joining device 'UB2000/3000/5000LS' is an ultrasonic metal joining device suitable for power devices. The ultrasonic horn is directly clamped by a rigid clamp. This results in the ultrasonic head being highly rigid and compact. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining. The joining capability is enhanced by linear pressurization that increases the load as the joining progresses. 【Features】 ■ High rigidity horn clamp mechanism ■ High precision position control ■ High functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

In the manufacturing of "next-generation secondary batteries," including all-solid-state batteries, various forms of joining and material cutting are required to meet high quality standards. Additionally, when performing joining or cutting processes, measures must be taken in the manufacturing equipment to prevent the generation of hydrogen sulfide due to reactions with moisture in the air. Our company offers "ultrasonic bonding devices and ultrasonic cutters" designed for next-generation secondary battery specifications, aimed at the joining/cutting of electrode foils, joining between battery terminals, and cutting of green sheets. Each device utilizes our unique technology based on ultrasonic waves, enabling high-quality direct bonding at room temperature and cutting without dragging the material. We also provide a dry environment where the evaluation conditions and equipment specifications can be verified with actual machines, allowing for consideration of implementation. 【Features of the Equipment】 <Joining> ■ Ultrasonic bonding device capable of wide-ranging foil bonding and compatible with dry environments <Cutting> ■ Ultrasonic cutter capable of straight/shape cutting and suitable for dry environments ■ Can cut negative electrode foils, positive electrode foils, Li foils, etc. <Fusing> ■ Can continuously and freely fuse separator materials through programming For more details about the products, please refer to the materials. Feel free to contact us with any inquiries.

Ultrasonic bonding devices used in various fields, such as power module terminal bonding and dissimilar metal bonding. At Adwells, we offer a lineup of "ultrasonic bonding devices" for a wide range of applications from R&D to mass production. Each device is compatible with terminal bonding, heat sink formation, DMB bonding, and more. We also conduct evaluation tests with demo units, so if you are interested, please contact us using the form below. 【Features of the device】 Terminal Bonding - Covers optimal bonding conditions for various terminals with a single device - Starts bonding by pressing down on the float with grounding load Heat Sink Formation - Directly forms fins (pins/ribbons) on the back surface of the substrate - High thermal conductivity (37 times that of TIM) due to direct bonding DMB Bonding - Can bond materials that can only handle low load and low output - No surface damage to materials during bonding: patternless horn - High thermal conductivity: about 7 times that of solder - Large area bonding *For more details, please refer to the PDF document or feel free to contact us.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.