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  3. アイン 本社工場
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Electronic Components and Semiconductors
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アイン 本社工場

EstablishmentApril 1, 1970
capital6000Ten thousand
number of employees107
addressNagano/Chino-shi/Toyohira 374-2 (Fukuzawa Industrial Park)
phone0266-72-7003
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last updated:Sep 05, 2022
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  • Products/Services(19)
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アイン List of Products and Services

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Ceramic wiring board Ceramic wiring board
Metal base substrate Metal base substrate
Ceramic ink Ceramic ink
High-frequency substrate High-frequency substrate
Copper base wiring board with posts Copper base wiring board with posts
Circuit board assembly Circuit board assembly
Copper selective etching / dissimilar material bonding Copper selective etching / dissimilar material bonding
Copper

Copper base wiring board with posts

It is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern.

Ain Corporation "Business Introduction"

Leave it to us for heat management substrates and high-frequency wiring boards!

Ain Corporation is a company primarily engaged in the sale of printed circuit boards, ceramic inks, and chemical industrial products. We provide a consistent product development process from design to production. We handle a wide range of high-performance substrates, such as "ceramics" and "VCM," which achieve excellent through-hole performance and bonding strength with low resistance values. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards ■ Manufacturing and sales of information control devices ■ Manufacturing, sales, and rental of printed circuit board manufacturing machinery and equipment ■ Sales of chemical industrial products *For more details, please download the PDF or feel free to contact us.

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Functional Product Tree Diagram

Introducing products by function such as high frequency, high thermal conductivity, and dimensional stability in a tree diagram!

This document introduces the products of Ain Co., Ltd., which engages in the design, manufacturing, and sales of printed circuit boards, categorized by function. It features various types of multilayer circuit boards (resin, metal, ceramics), including thick film printed circuit boards and inner layer thick copper circuit boards (with busbars). We respond to diverse needs such as high frequency, high thermal conductivity, and dimensional stability. 【Contents】 ■ High Frequency ■ High Thermal Conductivity ■ Dimensional Stability (Low Expansion) ■ High Heat Resistance ■ High Current *For more details, please refer to the PDF document or feel free to contact us.

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Thick copper wiring board

A wiring board that enables miniaturization and cost reduction through the substrate of high current circuits.

The "thick copper wiring board" is a wiring board that uses copper plates in the wiring layer to respond to the "high current" demands of the electronics industry. By creating a substrate for high current circuits, it enables miniaturization and cost reduction. 【Features】 ■ Responds to the "high current" demands of the electronics industry ■ Uses copper plates in the wiring layer ■ Miniaturization ■ Cost reduction *For more details, please refer to the PDF document or feel free to contact us.

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Substrate "Copper Base Wiring Board with Posts"

Direct heat conduction to the base material!

The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.

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[JPCA Exhibition] We will propose wiring boards tailored to your needs!

We will showcase various achievements at the exhibition. We will propose wiring boards that meet our customers' requirements using suitable materials and structures!

Ain Corporation will exhibit at the "JPCA Show 2023" held at Tokyo Big Sight. We plan to showcase our "DPC substrate," which is a wiring board formed by plating using ceramics as the base material, and the "AMB substrate," a thick copper ceramic substrate that excels in insulation, heat dissipation, and reliability. We will propose wiring boards that meet our customers' requirements with suitable materials and structures. 【Various Wiring Boards】 ■ Thermal Management: Ceramics, Metal ■ High Current: Ceramics, Metal ■ High Frequency: Resin ■ General Purpose: Resin We sincerely look forward to your visit. 【Event Overview】 ■ Dates: May 31 (Wed) - June 2 (Fri), 2023, 10:00 AM - 5:00 PM (tentative) ■ Venue: Tokyo Big Sight, East Exhibition Hall ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Exhibition Zone/Booth Number: Printed Circuit Board Technology Exhibition/6F-11 ■ Admission Fee: 1,000 yen (tax included) *Free for web registrants *For more details, please refer to the related links or feel free to contact us.

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