台技工業設備股份有限公司 TANGTECK EQUIPMENT INC 台灣桃園縣 TAIWAN

Contact this company
Contact Us Online
- Company information
- Products/Services(5)
- catalog(0)
- news(0)
台技工業設備股份有限公司 TANGTECK EQUIPMENT INC Company Profile
Integrity, service, quality, innovation, environmental protection
Taiwan Technology Industrial Equipment Co., Ltd. was established on December 16, 1988, adhering to the philosophy of "integrity, service, quality, innovation, and environmental protection" for sustainable management. With the rapid advancement of technology in the electronics industry in recent years, Taiwan Technology continuously demands excellence from itself to surpass its own limits; it focuses on research and development innovation to achieve high-quality equipment and professional technical services, serving a wide customer base.

Business Activities
Professional electronic industry furnaces - SMD reflow furnace, BGA reflow furnace, QA laboratory testing furnace PCB baking furnace, FPCB baking furnace DRY drying furnace Resistance firing furnace, high-temperature nitrogen firing furnace, sintering furnace Vacuum soldering furnace, DBC High-temperature box furnace (MLCC, LTCC) Biomedical furnace (for blood glucose test strips) Solar thermal industrial furnace, CIGS selenization furnace In-furnace temperature measuring device, in-furnace temperature testing instrument REFLOW Furnace, REFLOW Oven, Vacuum REFLOW, High Temperature Firing Furnace Muffle Furnace, Muffless Furnace Temperature profiler, Temperature Reflow checker
Products/Services (5)
Detailed information
Company name | 台技工業設備股份有限公司 TANGTECK EQUIPMENT INC 台灣桃園縣 TAIWAN |
---|---|
Contact address | Taiwan/ (All areas)/ No. 913, Shueiyuan Rd. Dayuan Township,Taoyuan County, Taiwan, R.O.C. TEL:886-3-386-7575 FAX:886-3-386-6955 |
Key Partners | For SMT Reflow Soldering Process For SMT Components or PCBs Quality Assurance Testing Purpose For SMT N2 Reflow Soldering Process and BGA,CSP, Flip chip Solder Ball Reflow Soldering For Thick Film Polymer Curing(Polymerization) For Chip Resister, Chip Inductor,Chip Capactior Firing Process,Hybrid Circuits, Thick Film Firing Process |
Industry | Industrial Electrical Equipment |
