三原精機 Company Profile

Miyahara Seiki will be of service to everyone through manufacturing. (Business succession took place in July 2023.)

Starting with the machining of parts for semiconductor manufacturing equipment over 40 years ago, we now also perform machining in other fields in addition to semiconductor manufacturing equipment. Plate items (up to 1000×2240) Round items (up to approximately 400φ ×800) Wire electrical discharge machining (500×350×300) Welded structures requiring secondary processing We process materials such as aluminum, stainless steel (SUS), copper, titanium, special steel (SK), and various resins (excluding cast iron). We also engage in the development, design, and manufacturing of equipment and units. Although we operate as an OEM, we have been involved in the development of several products that have sold quite well recently. Additionally, we assist startups. If you have an idea that you would like to bring to fruition, we are here to help.