スピードファム Product Lineup

This catalog introduces the equipment for IAG (Oxides, Sapphire, SiC, GaAs, Quartz, Ceramics, Metals, etc.) handled by Speedfam. It features standard models such as the "DSM 16B-5L/P-V," which can perform lapping and polishing regardless of material, and the "DSM10.5B-5L/P-V," which enables further stable processing with the addition of slurry flow and ALC fixed dimension system control. Details on features, dimensions, and the number of carriers are also provided. [Contents] ■Process and Application ■DSM 16B-5L/P-V ■DSM10.5B-5L/P-V ■FAM 50GPAW-III ■EPRO-212EN *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

This catalog introduces the silicon wafer processing equipment handled by Speedfam. It includes the polishing device "DSM20B-5P-4D-AL" for double-sided simultaneous mirror polishing of φ300mm silicon wafers, the "EP-300-X" with a dry-in-dry-out structure, and the "EP-200-XW-II" capable of cassette-to-cassette and slot-to-slot wafer transport. Please make use of this for product selection. [Contents] ■DSM20B-5P-4D-AL ■EP-300-X ■EP-200-XW-II ■Fully Automated Single Side Polishing Line FAM 59SPAW *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

This catalog introduces the consumable auxiliary materials handled by Speedfam. It features products such as the "Double Side Lapping Plate," which achieves high hardness and toughness (ductility) with a uniform and fine distribution of graphite for improved processing accuracy, and the "SUS P2 Carrier" and "SUS P3 Carrier," which are suitable for thin material processing of quartz, glass, compounds, etc. Applications and features are also introduced. [Contents] ■Process and Application ■Double Side Lapping Plate and Conditioning Ring ■Polishing Pad ■SUS P2 and P3 Carrier ■Edge Polishing Pads *For more details, please refer to the PDF document or feel free to contact us.

• Other consumables
• Other processing machines
• Processing Jig

SpeedFam develops "equipment" and "consumable materials" from both hardware and software perspectives with innovative technology and know-how to meet various customer needs and propose optimal processing processes. Edge polishing, which performs mirror surface processing on wafer edges and notches, is an essential processing technology in the semiconductor manufacturing process. Mirror polishing of edges and notches prevents particle generation and significantly improves surface cleanliness in the device process. 【Technology Introduction】 ○ Polishing processing technology ○ Flat polishing technology ○ Edge polishing (end face polishing), etc. For more details, please contact us or download the catalog.

• Wafer processing/polishing equipment
• Other processing machines