ケイ・オール List of Products and Services

With over 30 years of experience in the industry, K-All has consistently been involved in PCB assembly and has numerous achievements in reballing and reworking high-difficulty "underfill BGA." We provide a clear explanation of the fundamental knowledge of PCB assembly! We explain various terms, including "BGA," "CSP," "spectroscopic analysis equipment," "Vickers hardness," and "flow characteristics." We encourage you to read it. **Contents (partial)** ■ ABC: BGA/CSP/DIP/IPC standards/JIS standards/LGA ■ A section: Printability/Whisker/Wafer Level CSP/Liquid Phase Line Temperature ■ K section: PCB cleaning/Capillary Ball/Aggregation Force/Eutectic Solder ■ S section: Side Ball/Oxides/Initial Wettability/Squeegee ■ T section: Heat Resistance/Chip Stand/Claw/De-wetting/Dispenser ■ N section: Lead-free/Wettability/Adhesive Retention Time *For more details, please refer to the PDF document or feel free to contact us.*