ケイ・オール List of Products and Services

0402 and 0201 chips are components that have a very high difficulty level for modifications, proportional to the space-saving design of the circuit board. At K-All, we are also working on modifications for 0402 and 0201 chips and possess a wealth of know-how and proven results. Manual work can be completed in about one-fifth of the time compared to using rework machines. Additionally, we also design circuit boards equipped with 0402 and 0201 chips, offering designs that are proven to minimize defects. 【Features】 ○ Manual correction of Manhattan and chip misalignment ○ Both eutectic and lead-free options available ○ Extensive know-how and proven results ○ Capable of accurate and rapid responses ○ Work can be completed in a shorter time than with automatic repair machines For more details, please contact us or download the catalog.

For the implementation of special substrates and components for which no spares can be prepared, prior arrangements are extremely important. We propose suitable solutions regarding temperature conditions and implementation methods. In particular, we have accumulated know-how on profiles suitable for various types of substrates. Leave the implementation of difficult substrates, such as high-layer, high-current substrates, flexible substrates, and aluminum substrates, to us. 【Examples】 ■ Struggling with the implementation of thick substrates ■ Wanting to implement on an extra-large substrate (external dimensions 1m square) that cannot be fed into a reflow or mounter *For more details, please refer to the PDF materials or feel free to contact us.

In K-All's special modifications, we save our customers' important circuit boards through challenging and specialized modifications such as jumpers from the inner layers of the substrate and jumpers from LGA, achieving shorter delivery times and providing results that exceed simple circuit board remakes. Just like with regular pattern cuts and jumpers, we can also perform jumpers and pattern cuts for BGA and LGA. In most cases, this can be done at a lower cost and with a shorter lead time compared to circuit board revisions, so please don't hesitate to consult us. 【Features】 ○ Save important circuit boards with challenging special modifications ○ Achieve shorter delivery times ○ Provide results that exceed simple circuit board remakes For more details, please contact us or download the catalog.

Kei-Oll's special substrate mounting supports difficult-to-specify substrate implementations such as high-layer, high-current substrates, flexible substrates, and aluminum substrates. For the mounting of special substrates and components for which spares cannot be prepared, prior arrangements are extremely important. We will propose optimal solutions regarding temperature conditions and mounting methods. In particular, we have accumulated know-how on profiles suitable for various types of substrates. 【Features】 ○ Special substrates are our specialty! ○ Supports various substrates → Multi-layer substrates, aluminum core substrates, large substrates, thick substrates, thin substrates, irregularly shaped substrates, etc. ○ Adequate and safe profiles with abundant know-how ○ Proposes optimal solutions regarding temperature conditions and mounting methods For more details, please contact us or download the catalog.

At Kei All, we have been primarily engaged in the prototyping, repair, and modification of circuit boards since our founding. We can handle essential tasks such as pattern cutting and jumpers for circuit modifications, as well as the installation and replacement of components that are thought to be impossible with a soldering iron. We can also repair circuit board foot patterns, allowing even boards that were thought to be beyond repair to be revived. We have received a great deal of trust and achievements from many customers. Before giving up on a circuit board, please consult with us first. 【Features】 ■ Short delivery times available ■ Problem-solving with extensive experience and reliable technical skills ■ Rich track record in both eutectic and lead-free soldering ■ Collaboration with the design group for the production of conversion boards and more ■ Please consult us about projects that other companies have declined as "impossible" *For more details, please refer to the PDF materials or feel free to contact us.

We respond to various needs for "manual assembly" at K-All, with highly qualified technicians performing the work responsibly. We can also handle special materials such as flexible substrates and those with high heat dissipation, including aluminum and ceramics. Additionally, we can accommodate a wide range of components, from 0.4mm pitch connectors and QFPs to microchips. You can also rely on us for reflow-incompatible components, including PWBs larger than 500mm, with a thickness of over 4mm, as well as components with varying heights and heat resistance. 【Features】 - Capable of manual assembly for 0201 chips - Manual soldering for connectors and QFPs with a narrow pitch of 0.4mm - Capable of manual assembly for high-difficulty components - Manual assembly for flexible substrates is also possible - Supports both eutectic solder and lead-free solder *For more details, please refer to the PDF materials or feel free to contact us.

We perform accurate "manual placement" using our unique K-OHL drawings. Implementation of components from 0402 chips to QFPs, connectors, and BGAs is also possible. We have numerous achievements in aerospace and defense-related fields. Depending on the soldering conditions, we identify not only the workbench but also tools, and carry out work in an organized environment. 【Features】 ■ Support from a single piece ■ Manual placement possible with a dispenser even without a metal mask ■ Various components, including BGAs, can be manually placed using rework machines ■ Implementation is possible even without mounting data ■ Suitable for loose components ■ Manual placement on flexible substrates is also possible *For more details, please refer to the PDF document or feel free to contact us.

The features of K-All's "Mounter Implementation" are its ability to specialize in prototype production. In the case of prototype implementation, there may be instances where parts are inevitably supplied as cut or loose components. Our company can handle work with a mounter starting from just one piece, even with cut or loose supplies. 【Features】 ■ Capable of handling from one piece to medium lot and mass production ■ Efficient implementation suitable for various conditions ■ Capable of accommodating various types such as new package types, flexible substrates, and multilayer boards ■ Suitable mounter support ■ Difficult-to-obtain parts can be added later ■ Free provision of CR stock during prototyping *For more details, please refer to the PDF document or feel free to contact us.

We save our customers' important circuit boards through high-difficulty special modifications and achieve shortened delivery times, providing results that exceed simple board remakes. This is a service we would like to offer to those who have concerns such as, "I want to swap patterns for testing but want to keep costs down." With over 25 years of know-how, we can handle BGA jumpers and more. 【Examples】 ■ I don't have time to revise, so I want to make it work somehow with BGA jumpers. ■ I want to create an IC checker with PC⇔USB connection specifications. ■ I mistakenly swapped the patterns of the BGA pin by pin, so I want all pins wired with jumpers from the BGA. *For more details, please refer to the PDF document or feel free to contact us.

Rework technology is a point of pride for K-Oll. We are continuously honing our skills to handle high-difficulty components, which have seen an increase in implementation due to the miniaturization and high density of parts in recent years. This service is aimed at those who have concerns such as "I want to remove it, but the difficulty is high, and I am looking for a company that can rework high-difficulty components." 【Examples】 ■ I selected a BGA with a narrow pitch but am struggling to implement it. ■ A prototype board for SMT products with shield terminals (CN/LGA) is not functioning at all, and I want to replace the CN and reuse the LGA. *For more details, please refer to the PDF document or feel free to contact us.

At Kei All, we are capable of handling high-difficulty implementations and reworks. Recently, there has been a significant increase in components such as leads and thermal pads. These types of components can be very difficult to rework due to their shape and the configuration of the circuit board, as they tend to be less susceptible to heat. Rework technology is one of Kei All's proud strengths. We are continuously honing our skills to address high-difficulty components, which have been increasing in number due to the miniaturization and high density of parts. 【Features】 ○ Support for high-density, ultra-miniature components such as small camera modules and fine-pitch 0.3mm devices ○ Capability for high-difficulty implementations and reworks ○ Continuous technical training and skill development For more details, please contact us or download the catalog.

POP (Package On Package) is a technology that increases integration density by stacking IC packages that were previously arranged in a two-dimensional layout on a circuit board. It is primarily used in industries that manufacture mobile devices such as mobile phones, portable music players, and car navigation systems, where high-density implementation is required. By adopting a stacked structure for the packages, it allows for the combination of packages with different functions. 【Features】 ■ Reduces the occupied area of the package after implementation ■ Enables the combination of packages with different functions by using a stacked structure ■ Minimizes wiring between packages, reducing the impact of reflections and noise, and our company also supports POP configurations with three or more layers *For more details, please refer to the PDF materials or feel free to contact us.

At K-All, we can handle POP implementation and rework. The PoP technology, which stands for "Package on Package," is a technique that allows for the stacking of ICs and components on top of an IC package. With the technology of POP implementation, BGA implementation with an interposer board is also possible. Compared to jumper wiring, QCD (Quality, Cost, Delivery) is improved. It enables low-cost evaluation and signal conversion for BGA. Through discussions between our customers and K-All's design team, we promise reliable QCD. 【Features】 ○ Capable of POP implementation and rework ○ If there are many correction points, we can propose POP implementation using an interposer board ○ We can consider and propose the merits and demerits of both jumper and interposer board options For more details, please contact us or download the catalog.

Kei-Oll has numerous achievements in reballing and reworking with high-difficulty "BGA with underfill." Additionally, we can handle a wide range of micro sizes below 5×5mm and ball pitches from 1.27mm to 0.25mm, and we are capable of reballing for irregular and special pitch arrangements. We can assist in removing and reballing devices that are hard to obtain from other boards for implementation, especially when strict deadlines need to be met. 【Features】 ■ Two types of reballing technology (Capable of ball mounting using cream solder printing methods and dedicated flux application methods) ■ Supports micro-sized packages down to 5×5mm ■ Can accommodate changes in solder conditions (Composition changes from lead-free solder to eutectic solder are also possible) ■ Supports a wide range of pitches, including special pitches (Capable of handling ball pitches from 1.27mm to 0.25mm) *For details, please download the PDF or contact us.

At K-All, we have accumulated various work methods and technical research, enabling rework operations even on devices coated with various underfill materials! Using techniques such as replacement, re-implementation, re-balling, re-heating, underfill filling, BGA jumpers, and POP implementation for BGA, LGA, QFN, etc., we solve various issues related to circuit boards and devices. In this document, we present technical materials regarding BGA rework technology. Hardened underfill materials seal the BGA, significantly improving strength and effectiveness; however, rework tasks such as removal and component replacement become more challenging than standard rework processes. Our company has been working diligently to ensure that rework operations can be performed even on devices coated with various underfill materials. [Features of Underfill] - Uses a one-component heat-curing epoxy resin - Can reduce external stress - Prevents stress concentration on the connection surface of solder balls - Widely used in mobile devices, including mobile phones *For more details, please contact us or download the catalog!

At Kei All, we accept BGA rework even for boards that are not implemented in our own line. If it is at an early stage of the process, rework may be easily performed. We often receive requests for difficult BGA rework and reballing from other assembly companies in the industry. We support "BGA rework and reballing work that cannot afford to fail," especially for high-cost and hard-to-obtain devices. [Features] - Support for device rework - BGA rework compatible For more details, please contact us or download the catalog.

In the composition change of K-All's solder, we will switch from lead-free balls to eutectic balls. If the solder specifications of the substrate and the solder balls of the BGA differ, unexpected troubles may arise. K-All also conducts work to prevent implementation troubles by removing solder with different specifications and then attaching solder balls that match the specifications. We propose a reliable method while making use of your existing BGA. 【Features】 ○ Specification change from lead-free balls to eutectic balls ○ Preventing implementation troubles in advance through composition changes ○ Proposing a highly reliable method For more details, please contact us or download the catalog.

At Kei All's EMS service, we provide proposals that satisfy our customers regarding total quality, cost, and delivery time, with a focus on implementation and manufacturing, which we can uniquely offer as an implementation company. We accept contracts for various processes, either as a whole or by individual steps, including PCB design, PCB ordering, component purchasing, metal mask ordering, assembly, simple testing, coating work, X-ray inspection, cleaning (AS-300), underfill application, 0402/0201 chip modification and repair, PCB splitting, assembly testing, retrofitting only, visual inspection only, and pattern modification. 【Features】 ○ EMS compatible ○ One-stop service from design to assembly and integration ○ Support for PCB shape, component placement, and component selection ○ Total support for quality, cost, and delivery time For more details, please contact us or download the catalog.

● We will create the shape that the customer desires. We will create various jigs and substrates tailored to the customer's requests! Even for special substrates, Keio can manufacture them, so we will design substrates that can be produced while having preliminary discussions in-house. ● For more details, please download the catalog or contact us.

In times of need, our employees will work together to meet the desired delivery date. Flexibility in technology and quality response is essential for prototype implementation. This is a service we want to offer to those who are facing concerns such as, "We have a very tight deadline for our implementation project, but there are no manufacturers willing to take it on." When time is short, Keio will be here to help. [Examples] ■ The prototype boards produced by another company failed twice, leaving almost no lead time for implementation. ■ The pad sizes of the components do not match the board. *For more details, please refer to the PDF document or feel free to contact us.