We have numerous achievements in reballing and reworking "BGA with underfill," which is highly challenging in BGA reballing and rework! Technical materials featuring case studies are currently available!
Kei-Oll has numerous achievements in reballing and reworking with high-difficulty "BGA with underfill." Additionally, we can handle a wide range of micro sizes below 5×5mm and ball pitches from 1.27mm to 0.25mm, and we are capable of reballing for irregular and special pitch arrangements. We can assist in removing and reballing devices that are hard to obtain from other boards for implementation, especially when strict deadlines need to be met. 【Features】 ■ Two types of reballing technology (Capable of ball mounting using cream solder printing methods and dedicated flux application methods) ■ Supports micro-sized packages down to 5×5mm ■ Can accommodate changes in solder conditions (Composition changes from lead-free solder to eutectic solder are also possible) ■ Supports a wide range of pitches, including special pitches (Capable of handling ball pitches from 1.27mm to 0.25mm) *For details, please download the PDF or contact us.
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basic information
【A must-see for those with the following concerns】 - I want to remove and reball hard-to-obtain devices from another board and ensure strict adherence to delivery deadlines. - There is a strict demand for reducing prototype costs, and I want to achieve low-cost solutions by removing and reusing components from another board. - I want to remove devices for pattern modifications during prototyping, perform jumper wiring, and then reinstall them. *For more details, please refer to the PDF document or feel free to contact us.
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[Example: Request for Re-implementation of BGA that Failed at Another Company] We received a request for the re-implementation of a BGA that failed at another company, and we carried out the work without any issues. * Based on our technology and equipment capabilities, we often receive various requests from other companies in the same industry. * We also handle BGA rework, reballing, underfill rework, high-difficulty modifications, LGA implementation and rework, PoP rework, and more. * There are many requests for rework only from other companies in the same industry or their end-users.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.