JSWアフティ List of Products and Services

The AFTEX-8000 series is a fully automatic multi-layer film formation device that features two ECR plasma sources arranged at an angle in a single film formation chamber, capable of forming high-quality optical thin films and multi-layer films with excellent uniformity on substrates up to 8 inches in diameter. By using a high-activity, high-density ECR (Electron Cyclotron Resonance) plasma source and placing a target in the plasma extraction section, it achieves ECR plasma deposition using a solid source. There is no need to use hazardous gases like those in CVD, eliminating the need for exhaust gas treatment, making it an environmentally friendly film formation technology. 【Features】 ■ High insulation film characteristics ■ Multi-layer films ■ Dense and flat films ■ Low damage ■ Long-term stable operation *For more details, please refer to the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

The "AFTEX-6000 series" forms high-quality thin films at low temperatures and with low damage by directly reacting low-pressure, high-density ECR plasma flows with sputtered particles. Equipped with two ECR plasma sources, it enables fully automated transport and film formation, making it ideal for multilayer film formation. 【Features】 ■ Multilayer film formation with a wide range of film types ■ High refractive index control ■ High-speed film formation ■ High quality and high crystallinity at low temperatures and low damage ■ Cleaning effect on substrates and growth surfaces *For more details, please refer to the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

The "AFALD-8" is an atomic layer deposition device that enables film formation with atom-level thickness control on complex three-dimensional structures. It allows for high-quality thin film deposition in milliseconds, achieving stable film formation with low damage. It features user-friendly software and highly flexible configuration options. 【Features】 ■ Step coverage ■ High precision thickness control ■ Pinhole-free ■ Low damage ■ Reduced raw material costs *For more details, please refer to the catalog or feel free to contact us.

• Other machine elements
• Other semiconductor manufacturing equipment

The "AFTEX-2300" is a high-performance solid source ECR plasma deposition system equipped with a microwave branch-coupled ECR ion source, a load-lock mechanism, and a turbo molecular pump, all at a low price. Thin films grow under the irradiation of high-density ions controlled at low energies of 10-30 eV, resulting in dense, high-quality thin films with atomic-level smoothness. Thanks to the ion assist effect, it is possible to form compound thin films such as oxide and nitride films without high-temperature heating, and it is also possible to obtain highly crystalline thin films at low temperatures. 【Features】 ■ Equipped only with the basic functions of a solid source ECR plasma deposition system ■ Lower price compared to automatic deposition systems ■ Achieves long-term stable operation ■ Clean deposition environment ■ Various interlock mechanisms adopted *For more details, please refer to the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment

The "AFTEX-9000 series" is a device capable of achieving high-quality nano thin film formation at low temperatures and with low damage. It supports substrate sizes of up to 8 inches and can accommodate up to three ECR plasma sources, significantly improving productivity by operating them simultaneously. Please use our equipment for nano thin film formation. 【Features】 ■ A fully automated C to C single wafer system with a multi-chamber design that can connect up to three ECR deposition modules for 8-inch substrates. ■ Achieves high productivity with simultaneous deposition using three ECR plasmas. ■ Allows for the setting of transport flow, deposition chamber, and deposition process through recipes, enabling fully automated deposition of multilayer films with any material. ■ Excellent uniformity is achieved through substrate tilt rotation and low-pressure deposition. ■ An in-device spectroscopic system (optional) enables measurement of film thickness, refractive index dispersion, etc. ■ Directly reacts raw material particles from solid sources with a highly active ECR plasma flow, eliminating the need for expensive exhaust treatment equipment and being environmentally friendly. *For more details, please refer to the catalog or feel free to contact us.

• Other semiconductor manufacturing equipment