Multi-material multilayer films can be formed! A film deposition device capable of high-quality, high-crystallinity thin film formation.
The "AFTEX-6000 series" forms high-quality thin films at low temperatures and with low damage by directly reacting low-pressure, high-density ECR plasma flows with sputtered particles. Equipped with two ECR plasma sources, it enables fully automated transport and film formation, making it ideal for multilayer film formation. 【Features】 ■ Multilayer film formation with a wide range of film types ■ High refractive index control ■ High-speed film formation ■ High quality and high crystallinity at low temperatures and low damage ■ Cleaning effect on substrates and growth surfaces *For more details, please refer to the catalog or feel free to contact us.
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**Main Specifications** ■Reachable Pressure - Processing Chamber: Below 3x10-5 Pa - Load Lock Chamber: Below 3x10-4 Pa ■Vacuum Exhaust System - Film Deposition Chamber: Turbo Molecular Pump 1000 l/sec - Load Lock Chamber: Turbo Molecular Pump ■Film Deposition Chamber - Sputter Sources: 2 ECR types, 2 Magnetron types (optional) - Substrate Holder: Flat plate step rotation, substrate size max. 3 inches - Substrate Heating: Up to 400℃ - Substrate Position: Distance between target and substrate: 170 mm ■LL Chamber - Transport Method: Automatic tray transport, processing 5 pieces at once - Sample Count: 5 tray sets possible in LL chamber ■ECR Plasma Source - Quantity: 2 units - Plasma Source: Microwave branch-coupled ECR plasma source - Plasma Chamber: Inner diameter Φ150 mm, water-cooled jacket structure - Cylindrical Target Section: Cylindrical type, inner diameter Φ100 x width 40 mm, direct cooling method for backing tube ■Gas Introduction System: Mass Flow Controller: 3 systems - Gas Types: Argon, Oxygen, Nitrogen ■Operation - Exhaust: Automatic - Substrate Transport: Automatic - Film Deposition: Automatic / Manual (switchable) *For more details, please refer to the catalog or feel free to contact us.*
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Applications/Examples of results
Semiconductor laser end face coating Various optical devices
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Company information
JSW Afti Corporation has been developing based on ECR plasma deposition technology within the NTT Group since its establishment. It started as part of the Mitsui Engineering & Shipbuilding Group in September 2007, when the semiconductor and flat panel manufacturing equipment businesses of the group companies were integrated into our company. In April 2014, we began anew as part of the Japan Steel Works Group, consistently handling everything from development to manufacturing, sales, and after-sales service, contributing even more to the value creation for our customers. We will not only unleash the potential of the technological resources we have developed and accumulated so far but also focus on their improvement and the development of new technologies, striving through these efforts to realize a prosperous future for our customers, ourselves, and society.