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  6. Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

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last updated:Jan 23, 2023

JSWアフティ
JSWアフティ
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A fully automatic multilayer film forming device that can form multilayer films with excellent uniformity!

The AFTEX-8000 series is a fully automatic multi-layer film formation device that features two ECR plasma sources arranged at an angle in a single film formation chamber, capable of forming high-quality optical thin films and multi-layer films with excellent uniformity on substrates up to 8 inches in diameter. By using a high-activity, high-density ECR (Electron Cyclotron Resonance) plasma source and placing a target in the plasma extraction section, it achieves ECR plasma deposition using a solid source. There is no need to use hazardous gases like those in CVD, eliminating the need for exhaust gas treatment, making it an environmentally friendly film formation technology. 【Features】 ■ High insulation film characteristics ■ Multi-layer films ■ Dense and flat films ■ Low damage ■ Long-term stable operation *For more details, please refer to the catalog or feel free to contact us.

    Other semiconductor manufacturing equipment
AFTEX-8000Series.png

Solid Source ECR Plasma Deposition Device "AFTEX-8000 Series"

AFTEX-8000Series.png
AFTEX-8000Series.png
  • Related Link - https://jsw-afty.co.jp

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【Vacuum Exhaust System Specifications】 ■Achievable Pressure Process Module: < 3×10-5Pa Transfer Chamber: < 3×10-4Pa Load Lock Chamber: < 3×10-4Pa ■Vacuum Exhaust System Process Module: Turbo Molecular Pump 1300L/sec Dry Pump: 600L/min Transfer Chamber: TMP 820L/sec Dry Pump: 500L/min Load Lock Chamber: TMP 350L/sec Dry Pump: 250L/min ■Load Lock Chamber Manual Door: 1 set Cassette Elevator Mechanism: 1 set Sample Detection Mechanism: 1 set ■Transfer Chamber Vacuum Transport Robot: 1 set Sample Detection Mechanism: 1 set Face-Down Transport Method *For more details, please refer to the catalog or feel free to contact us.

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JSWアフティ

JSWアフティ

Electronic Components and Semiconductors

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JSW Afti Corporation has been developing based on ECR plasma deposition technology within the NTT Group since its establishment. It started as part of the Mitsui Engineering & Shipbuilding Group in September 2007, when the semiconductor and flat panel manufacturing equipment businesses of the group companies were integrated into our company. In April 2014, we began anew as part of the Japan Steel Works Group, consistently handling everything from development to manufacturing, sales, and after-sales service, contributing even more to the value creation for our customers. We will not only unleash the potential of the technological resources we have developed and accumulated so far but also focus on their improvement and the development of new technologies, striving through these efforts to realize a prosperous future for our customers, ourselves, and society.

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