筑波精工 List of Products and Services

"Tinhand" is an electrostatic adhesion tool designed for automatic machines that softly adsorbs, fixes, and handles films, foils, and paper. It allows for full soft adhesion of large-area thin materials without causing wrinkles or scratches, and it can also adsorb perforated items like porous materials. Additionally, the backside potential of the object is minimized, preventing dust adhesion on the backside. 【Features】 ■ Full soft adhesion of large-area thin materials ■ No wrinkles or scratches ■ Capable of adsorbing perforated items like porous materials ■ Backside potential of the object is minimized, preventing dust adhesion *For more details, please refer to the PDF document or feel free to contact us.

• others

The "Electrostatic Chuck Supporter" is an electrostatic chuck carrier that adsorbs and holds ultra-thin workpieces for reinforcement. It enables the reinforcement and fixation of thin wafers solely through electric field control, without the use of adhesives. Being cordless allows it to be inserted into various processes while maintaining a fixed state, and it can be inserted into the carrier while holding the wafer in an adsorbed state due to its thin profile. 【Features】 ■ Adsorbs and holds ultra-thin workpieces for reinforcement ■ Enables reinforcement and fixation of thin wafers ■ Can be inserted into various processes ■ Thin profile allows insertion into the carrier while holding the wafer in an adsorbed state *For more details, please refer to the PDF document or feel free to contact us.

• others

The "Soft Palm" is a handy type of electrostatic chuck that uses Coulomb force to contact and adsorb objects for handling. Its main feature is that it applies localized stress to thin materials due to its surface adsorption. Additionally, there are two types available: a battery-operated (rechargeable) cordless type and a semi-cordless type driven by a dedicated controller. 【Features】 ■ Portable anywhere due to being cordless ■ Can adsorb objects with uneven surfaces ■ The potential is minimized, so there is no dust adsorption on the backside *For more details, please request materials or view the PDF data available for download.

• Other semiconductor manufacturing equipment