スマートビジョン List of Products and Services

The Product Line T is a high-resolution, high-magnification transmission X-ray source. The target output is up to 10W, with a minimum focus on the object of 0.25mm, achieving a high resolution of 2.0μm.

• X-ray inspection equipment

A linear detector array composed of CMOS silicon photodiode array detector chips mounted on a single substrate. The imaging circuit of each detector chip consists of a continuous array of photodiodes, a timing generator, a digital scan shift register, an array of charge integration amplifiers, sample and hold circuits, and a signal amplification chain. Each detector array generates an end of scan (EOS) used to initiate scanning of the next detector array. In X-ray scan applications, scintillator materials tailored to the user's application, which convert X-ray photons into visible light, are attached to the surface of the detector array to enable detection by the photodiode array. The photodiode array of the XB8801R reduces radiation damage caused by the X-ray beam. The signal processing circuits are positioned 2mm away from the photodiodes and are shielded from direct X-ray radiation by an outer heavy metal shield. The precise alignment of the metal shield to the signal processing circuits is performed at the factory using specially molded housings and chip-on-board (COB) technology.

• X-ray inspection equipment

A linear detector array composed of CMOS silicon photodiode array detector chips mounted on a single substrate. The imaging circuit of each detector chip consists of a continuous linear array of photodiodes, a timing generator, a digital scan shift register, an array of charge integration amplifiers, a sample-and-hold circuit, and a signal amplification chain. Each detector array is longer to generate an end-of-scan (EOS) used to start scanning the next detector array, while continuous detector arrays are formed from smaller daisy-chained detector arrays. In X-ray scanning applications, a scintillator material tailored to the user's application can be attached to the surface of the detector array to convert X-ray photons into visible light, making them detectable by the photodiode array. The photodiode array reduces radiation damage from X-ray beams. The signal processing circuit is positioned 2mm away from the photodiodes and is shielded from direct X-ray radiation by an outer heavy metal shield. The precise alignment of the metal shield to the signal processing circuit is performed at the factory using specially shaped housings and chip-on-board (COB) technology.

• X-ray inspection equipment

The 【XI8800 series】 is a linear array X-ray camera that provides high performance for X-ray scanning applications with a long length. At the center of the XI8800 camera, the CMOS silicon imaging detector array chip for X-scan imaging offers a wide dynamic range and semiconductor reliability. A wide selection of scintillation materials converts X-rays into visible light for detection by the imaging array, optimizing both sensitivity and resolution. The proximity of the analog-to-digital converter (ADC) to the detector chip and the use of low-voltage differential signaling (LVDS) technology minimize interference noise. A collection of hardware for interfacing with software, including computers and drivers, as well as an intuitive application programming interface (API), such as code software, facilitates the development of X-ray scanning systems.

• others

The 【XTI12848 TDI Series】 is a long-life camera suitable for inline inspection applications that require high speed, high sensitivity, and high resolution. TDI (Time Delay Integration) is a special image acquisition method used in inline inspection applications that require high speed, high sensitivity, and high resolution. When equipped with appropriate shielding, it is specifically designed for use in imaging applications such as high-energy X-rays, gamma rays, and betatrons, with an off-axis, FOP (Fiber Optic Plate) design that protects the CCD sensor from direct harmful radiation. Users can select scintillators for specific applications. The pixel size is 48×48µm. The binning modes are 2×2, 4×4, 8×8, and others, allowing for imaging at lower resolutions.

• others

The ECS-7000 series is a high-performance fanless PC that offers a wide range of products, including types that allow for easy DIO/HDD removal and replacement, as well as models with SSD/HDD trays. The VMware Ready certification has been obtained for the Vecow ECS-7000 series fanless embedded system, making it compatible with the virtualization platform VMware vSphere 5.5.

• Industrial PCs

This product features PCI/PCIe expandability and is a unique fanless embedded system ideal for machine vision, outdoor photography, 3D image processing, ITS (Intelligent Transportation Solutions), quality control, and medical imaging applications. It is available in five models: "RCS-7422A/7422/7404" and "RCS-7220/RCS-7221." All models are equipped with an Intel quad-core processor (6M Cache, up to 3.30GHz), allowing for the selection of i7/i5/i3 Ivy Bridge, and they come with the QM77 chipset. The fanless design enables operation in a temperature range of -25 to +70°C.

• Industrial PCs

Flexibly respond to diverse demands such as high-speed image processing and high quality in application fields including automotive, medical, military, and ITS (Intelligent Transportation Systems).

• others

By executing real-time detection and post-analysis tasks, we save labor and enhance reliability, and we offer industrial PCs (all products are fanless PCs, and some products support SUMIT standards) that can be widely applied across various industries.

• Industrial PCs

By performing positioning, classification, measurement, and inspection, it is widely used in electronic components, semiconductors, automobiles, food and pharmaceuticals, as well as in traffic monitoring systems, onboard cameras, and security applications.

• Industrial PCs

The 【ePM-AOI】 is the representative tool of the ePM-Ex solution and is a job program creation tool for AOI devices that is easy and quick to use. The ePM solution aims for minimal personnel, the shortest program time, maximum efficiency in data management, and zero defects.

• others

ePM-SPI is the representative tool of the ePM-Ex solution and is chosen by world-class SPI equipment companies as a job program creation tool for SPI devices. The ePM solution aims for minimal personnel, the shortest program time, maximum efficiency in data management, and zero defects.

• others

The 【ePM-Ex】 is a tool that provides everything from PCB design and metal mask verification to programming for SMT/SPI/AOI equipment, all in one job. It is a single tool with a unified interface, yet it allows for flexible handling of any program. It achieves zero defects with minimal personnel, the shortest program time, and maximum efficiency in data management.

• others

VX2D is a two-dimensional X-ray imaging software for measuring and analyzing 2D slice data (Manufacturer: 3D Industrial Imaging Co., Ltd.). It provides various measurement tools and can output measurement information to Excel, as well as utilize various filtering functions for more advanced analysis. Additionally, the ball void detection module is a module for VX2D that performs automatic analysis of solder balls.

• X-ray inspection equipment

The 【VXPI】 is an add-on module for VX3D that automatically detects voids from 3DX X-ray CT images (manufacturer: 3D Industrial Imaging Co., Ltd.). It provides information on the size, volume, location, and density of inclusions and cavities, and is capable of detecting defects such as shrinkage cavities, gas holes, and foreign objects in aluminum, magnesium, iron, zinc, and plastics. Defect analysis can be performed not only on metal cast parts like aluminum, magnesium, iron, and zinc but also on plastic parts using 3DX X-ray CT images.

• X-ray inspection equipment

It enables intuitive automatic visualization solutions such as auto-cropping, clipping, and zoom cube functions, provides various measurement tools for 2D or 3D data analysis, and offers powerful reporting features to users. In particular, it is developed for practical industrial CT applications and can be effectively utilized for defect analysis in industrial purposes by adding the VXPI (Void Detection Module) as an add-on.

• X-ray inspection equipment

Provides excellent quality 2D and 3D images at high magnification with stable output and small spot size. Combines an end-window X-ray tube, high-voltage power supply, and controller in a compact package with a 28VDC power supply, making it suitable for automatic inspection and component inspection.

• X-ray inspection equipment

Provides excellent quality 2D and 3D images at high magnification with stable output and a small spot size. Additionally, the wide and uniform beam is ideal for automatic inspection, which requires a wide field of view to improve throughput. Product from Thermo Fisher Scientific, USA.

• X-ray inspection equipment

With stable output and a small spot size, high magnification provides excellent quality 2D and 3D images. Combining an end-window X-ray tube, high-voltage power supply, and controller in a compact 12VDC package demonstrates its power in high-resolution manual PCB and semiconductor applications.

• X-ray inspection equipment

Suitable for manual inspection of printed circuit boards and electronic devices, non-destructive testing requiring high-resolution images of metals and plastics, and micro CT imaging for industrial and life science applications.

• X-ray inspection equipment

The 【PXS5-822(-WB)】 is an 80kV micro-focus X-ray source used for high-resolution imaging in a side window configuration. The side window configuration is effective for compact cabinets that require high magnification, providing excellent quality 2D and 3D images with a small spot size and stable output. It combines the X-ray tube, high-voltage power supply, and controller in a compact package powered by a 12VDC supply.

• X-ray inspection equipment

The "1215A" is an industrial X-ray flat panel with a high resolution and real-time imaging, featuring a detection area of 116.4×145.7mm. The CMOS sensor has high sensitivity and very excellent low-noise technology. Additionally, the digital output is 14 bits, providing a wide dynamic range. The high durability and functionality of this product result in high-quality images. 【Features】 ■ High-sensitivity CMOS sensor ■ Low-noise technology ■ 14-bit digital output ■ High durability and functionality ■ Gigabit Ethernet (Camera Link option available) *For more details, please refer to the PDF document or feel free to contact us.

• X-ray inspection equipment

The "0505A" is an industrial X-ray flat panel with high resolution and real-time imaging. It is ideal for non-destructive testing of PCBs, BGAs, and for micro-CT tomography. The CMOS sensor features high sensitivity along with excellent low-noise technology. Additionally, the digital output is 14 bits, providing a wide dynamic range. 【Features】 ■ High-sensitivity CMOS sensor ■ Low-noise technology ■ 14-bit digital output ■ Ideal for non-destructive testing and micro-CT tomography ■ Gigabit Ethernet (Camera Link option available) *For more details, please refer to the PDF document or feel free to contact us.*

• X-ray inspection equipment

"GO-SCAN" is a portable X-ray device manufactured by Teledyne ICM, equipped with a high-resolution CMOS detector and a lightweight X-ray generator. It is battery-operated and utilizes a CMOS flat panel instead of traditional film or image plates, allowing for real-time image viewing and the ability to save and edit imaging data on a PC. 【Features】 ■ Ideal for non-destructive testing ■ Uses a CMOS flat panel ■ Imaging data can be saved and edited on a PC ■ Operates over a wide temperature range ■ Resistant to all types of mechanical damage *For more details, please request materials or view the PDF data available for download.

• X-ray inspection equipment