兼松ＰＷＳ Product Lineup

Features: - Automated transport system - Up to 30% improvement in UPH - Capable of bonding to balls as small as 22µm with 0.5mil wire - Dual magnification optical path, dual-color coaxial light Other ASM equipment available: - Multi-laser dicing equipment - 2D and 3D package appearance inspection equipment - Other die bonders (alignment accuracy from 0.2µm to 25µm) ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.